Thread: Anandtech News

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    #10141

    Anandtech: Microsoft Announces Xbox Series X: Available Holiday 2020

    Microsoft this evening has finally given their long-awaited next generation gaming console a name, announcing the Xbox Series X. The device, formerly known as Project Scarlett, is said to be four times more powerful than the current Xbox One X, and along with its new Xbox Wireless Controller will be available in the Holiday 2020 timeframe.
    Microsoft has been drip-feeding information about their forthcoming console for the better part of a year now, so today’s announcement of the name and revealing the final design is the latest element in that campaign. The black, monolith-shaped box is certainly unlike any previous Xbox console design, and while touching it probably won’t make you smarter, Microsoft has definitely evolved the design of their hardware. The same goes for the new Xbox Wireless Controller that ships with the console, which incorporates an unusual D-Pad derived from the Xbox Elite Series 2 Wireless Controller. The controller will be compatible with Windows 10 as well.

    While Microsoft is still not offering a detailed breakdown of hardware specifications at this time, the company has reiterated their E3 announcement – that the box is powered by an AMD APU combining their Zen 2 processor cores and next generation RDNA architecture – while revealing the first performance estimate for the console: four times the processing power of the Xbox One X. It’s not clear here whether Microsoft is talking about CPU performance, GPU performance, or both – but given that even AMD’s fastest discrete GPUs today don’t exceed 10 TFLOPS, it is likely a reference to the CPU side of matters and AMD’s much faster Zen 2 CPU cores (and going by comments made to GameSpot, this seems to be exactly the case).
    As well, the company is reiterating the technical features for the console: hardware raytracing, variable rate shading, Xbox One backwards compatibility, and a “next-generation” SSD. All of which will be used to offer games at 4K@60fps or better, with Microsoft indicating that 120fps will also be an option for developers (no doubt driven by the high refresh rates allowed by HDMI 2.1). In their press release Microsoft is also announcing a new feature called “Dynamic Latency Input” (DLI), which although no specific details about the technology are being made available, is intended to minimize console latency in order to make it “the most responsive console ever”. I would expect to hear more about this in 2020 as the console gets closer to launch.
    Finally, along with announcing the console itself, Microsoft has also released a separate video announcing a new Hellblade game, Senua’s Saga: Hellblade II. The trailer for the game is designed to show off the power of the console and is based off of in-engine footage; though it’s not clear at this time if it was captured in real-time or rendered offline.
    Expect to hear a lot more about the Xbox Series X over the next year, as Microsoft ramps up to launch it for Holiday 2020.


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    #10142

    Anandtech: The Microsoft Surface Laptop 3 Showdown: AMD's Ryzen Picasso vs. Intel's I

    Occasionally the stars align. It is very rare in the laptop space that we're able to test two devices, with two very different CPU platforms, with the fewest number of variables possible. But those stars have aligned in 2019, and thanks to Microsoft's Surface Laptop 3 family, we have a rare opportunity to compare AMD and Intel's current-generation laptop platforms in a way that wouldn't normally be possible.
    To that end, today we're having the ultimate laptop showdown of 2019: Surface Laptop 3 vs. Surface Laptop 3, pitting AMD's Ryzen Picasso platform against Intel's Ice Lake platform. Both companies have made significant gains this year with their latest laptop platforms, and now we're finally getting the chance to see, in an apples-to-apples-fashion, just how the two platforms compare.

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    #10143

    Anandtech: LG Updates Ultralight Gram Laptops & Convertible: Ice Lake Inside

    Along with their flagship 17-inch model, LG this week has also given its 14 and 15.6-inch LG gram laptops an Ice Lake upgrade. The updated machines pair Intel’s Ice Lake processors with up to 24 GB of RAM, all contained within the gram's minimalist, ultra-thin carbon magnesium alloy body, with a total weight of around 1 kilogram. The new LG gram notebooks and convertible will be available next year.
    The 2020 LG gram mobile PCs are powered by Intel’s 10th Generation Core processor (Ice Lake) with up to Iris Plus Graphics. The CPU is cooled down using LG’s Mega Cooling System, though the only thing that the company says about it is that it runs cool and quiet ‘under all usage scenarios’. The updated notebooks can be equipped with up to 24 GB of DDR4-2666 memory, whereas the convertible only supports up to 16 GB of RAM. Meanwhile, all the machines feature two M.2 slots for a couple of NVMe SSDs to provide both speed and capacity.
    Being premium consumer laptops, LG’s next year gram systems come equipped with a robust set of I/O capabilities, which includes Wi-Fi 6, Bluetooth, Thunderbolt 3, USB 3.1, HDMI, microSD/UFS slot, and a 3.5-mm audio jack for headsets. As far as multimedia features are concerned, the notebooks have a webcam, DTX X Ultra-badged speakers, and a microphone array. Finally, they also have a fingerprint reader.
    One of the key selling points of LG’s gram mobile PCs is their long battery life. The new 14-inch machines will use a 72 Wh battery, whereas the 15.6-inche will come with an even larger 80 Wh battery. The maker says that the convertible LG gram 2-in-1 machine will work for over 20 hours on one charge, and the 15.6-inch model should be able to last for even longer.
    The LG Gram 2020 Brief Specifications
    LG Gram 2-in-1
    14T90N
    LG Gram 14
    14Z90N
    LG Gram 15
    15Z90N
    Size 14-inch IPS 15.6-inch IPS
    Screen Resolution 1920×1080
    Touch Support LG's IPS In-Cell Touch technology - -
    Color Gamut ? over 96% sRGB
    Protection Corning Gorilla Glass 6 - -
    CPU Family 10th generation Intel Core processors (Ice Lake)
    Model various
    Graphics Intel UHD Graphics Intel UHD Graphics or Intel Iris Plus Graphics
    RAM up to 16 GB DDR4-2666
    onboard + SO-DIMM
    up to 24 GB DDR4-2666
    onboard + SO-DIMM
    Storage up to two M.2 NVMe SSDs
    Wi-Fi + BT Wi-Fi 6 + Bluetooth
    USB 2
    × USB 3.1 Type-A
    1
    × USB 3.1 Gen 2 via TB3
    3
    × USB 3.1 Type-A
    1 × USB 3.1 Gen 2 via TB3
    Thunderbolt 3 1
    × T
    hunderbolt 3
    Fingerprint Sensor Yes
    Audio Microphone array, DTS X Ultra stereo speakers, TRRS jack
    Other I/O MicroSD card reader, webcam, etc.
    Battery 72 Wh 80 Wh
    Battery Life over 20 hours many hours many hours
    Dimensions Width 324.6 mm | 12.78 inch 323.4 mm | 12.73 inch 357.6 mm | 14.08 inch
    Depth 210.8 mm | 8.3 inch 209.8 mm | 8.26 inch 225.3 mm | 8.87 inch
    Thickness 17.9 mm | 0.7 inch 16.8 mm | 0.66 inch 16.8 mm | 0.66 inch
    Weight 1145 grams | 2.52 lbs 999 grams | 2.2 lbs 1120 grams | 2.47 lbs
    LG will demonstrate its new portables at CES 2020 in early January. Expect the company to disclose more information about pricing and availability timeframes there as well.
    Related Reading:


    Source: LG


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    #10144

    Anandtech: Western Digital Rolls-Out Two New SweRV RISC-V Cores For Microcontrollers

    Western Digital has added two new processor cores — the SweRV Core EH2 and the SweRV Core EL2 — into its SweRV portfolio of microcontroller CPUs. And, keeping in line with past parts, and the company has made their register-transfer level (RTL) design abstraction available to the industry for free. In addition, the company has also introduced the first hardware reference design for OmniXtend cache coherent memory over Ethernet protocol, and transferred management and support of the architecture to Chips Alliance.



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    #10145

    Anandtech: Samsung Unveils Galaxy A51 & Galaxy A71 Mid-Range Smartphones: 6.5/6.7-Inc

    While Samsung draws most of its smartphone reputation from its high-end phones, the bulk of the phones that the company sells are are not the $700+ Galaxy S series, but rather the cheaper phones that fill out the lower parts of its product stack. To that end, Samsung has unveiled its new mid-range Galaxy A51 and Galaxy A71 smartphones, which are designed to strike a better balance between features and the handset's cost.
    As their model numbers suggest, Samsung’s Galaxy A51 and Galaxy A71 smartphones are designed for different price points, yet they have many similarities. Both handsets come in a plastic body, which depending on the model houses either a massive 6.5-inch (A51) or a 6.7-inch (A71) Infinity-O Super AMOLED. Both models get similar panels, each sporting a 2400:1080 resolution as well as an ultrawide 20:9 aspect ratio. The display in turn is protected with Corning's Gorilla Glass 3, which although not the latest and greatest there, is not particularly surprising (nor a bad choice) since, unlike the S-series, these smartphones are not water-tight.
    Meanwhile, with cameras being one of the big selling points for flagship phones this past year, Samsung has tried to bring as much of this down to their mid-range phones as possible. Both smartphones feature a quad-module rear camera setup, consisting of a 48 MP or a 64 MP main module, a 12 MP ultrawide module, a 5 MP depth sensor, and a 5 MP dedicated macro module. As always, we'll have to see how well these camera modules actually work once the phones are shipping, but it's a surprisingly aggressive number of modules to ship a cheaper phone with. Finally, rounding out the camera collection for both phones is a 32 MP punch-hole selfie camera.
    As for internal hardware, the Galaxy A51 is powered by the Exynos 9611 SoC, which offers 4 Cortex-A73 cores plus 4 Cortex-A53 cores. This is paired with paired with 6 GB of RAM and 128 GB of NAND flash storage. Meanwhile the Galaxy A71 is based on the Snapdragon 730 – a 2x Cortex-A76 plus 6x Cortex-A55 SoC – accompanied by 6 GB or 8 GB of memory, as well as 128 GB of NAND. The new smartphones obviously support 4G/LTE, Wi-Fi 5, Bluetooth 5.1, navigation, a USB 2.0 Type-C port, an under-screen fingerprint reader, and integrate a 4,000 or 4,500 mAh battery respectively.
    Samsung's Galaxy A51 & Galaxy A71 Smartphones
    Brief Specifications
    Galaxy A51 Galaxy A71
    Display SAMOLED
    6.5"
    2400x1080
    20:9
    Corning Gorilla Glass 3
    SAMOLED
    6.7"
    2400x1080
    20:9
    Corning Gorilla Glass 3
    SoC Samsung Exynos 9611

    4 x Arm Cortex-A73 @ 2.3 GHz
    4 x Arm Cortex-A53 @ 1.7 GHz
    Arm Mali-G72 MP3
    Qualcomm Snapdragon 730

    2 x Kryo 470 Gold (CA76)
    @ 2.2 GHz
    6 x Kryo 470 Silver (CA55)
    @ 1.8 GHz
    Adreno 618
    RAM 6 GB 6 GB or 8 GB
    Storage 128 GB of NAND flash
    microSD
    128 GB of NAND flash
    microSD
    Local Connectivity Wi-Fi 802.11ac Wi-Fi
    Bluetooth Bluetooth 5.0
    Data/Charging USB 2.0 Type-C
    Audio 3.5-mm jack
    stereo speakers
    active noice cancellation
    NFC depending on the market
    4G/LTE Yes
    Navigation A-GPS, GLONASS, BDS, GALILEO
    Rear Camera Main 48 MP, f/2.0, 1/2", 0.8µm
    PDAF
    64 MP, f/1.8, 1/1.7", 0.8µm, 26 mm
    PDAF
    Ultrawide 12 MP, f/2.2, 13mm
    Depth 5 MP, f/2.2
    Macro 5 MP, f/2.4
    Main Lense Assembly ? ?
    Front Camera 32 MP, 1.28", f/2.2, 0.8µm
    Battery Capacity 4000 mAh
    15 W fast charging
    4500 mAh
    25 W fast charging
    Expected Life ? ?
    SIM Size Nano SIM, single or dual
    Sensors accelerometer, gyro, proximity, compass
    Biometric Security Fingerprint Under display
    Facial Recognition - -
    Dimensions Height 158.5 mm | 6.24 inches 163.6 mm | 6.44 inches
    Width 73.6 mm | 2.90 inches 76 mm | 2.99 inches
    Thickness 7.9 mm | 0.31 inches 7.7 mm | 0.3 inches
    Weight 172 grams 179 grams
    Colors Prism, Crush Black, White, Blue, Pink
    Protection Drop ? ?
    Splashes - -
    OS Google Android 9.0 with One UI
    Launch Countries Vietnam, Poland Poland
    Price ~€310 ?
    So far, Samsung has introduced its Galaxy A51 and Galaxy 71 in Poland and Vietnam and while other markets have not yet been announced, it's only a matter of time (and presumably after the new year). The A51 will be available in Vietnam in late December, so expect the A71 to hit the market a bit after that.
    Related Reading:


    Sources: Samsung Poland, Samsung Vietnam, GSMArena, GSMArena, Liliputing


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    #10146

    Anandtech: The Snapdragon 865 Performance Preview: Setting the Stage for Flagship And

    Earlier this month we had the pleasure to attend Qualcomm’s Maui launch event of the new Snapdragon 865 and 765 mobile platforms. The new chipsets promise to bring a lot of new upgrades in terms of performance and features, and undoubtedly will be the silicon upon which the vast majority of 2020 flagship devices will base their designs on. We’ve covered the new improvements and changes of the new chipset in our dedicated launch article, so be sure to read that piece if you’re not yet familiar with the Snapdragon 865.
    As has seemingly become a tradition with Qualcomm, following the launch event we’ve been given the opportunity to have some hands-on time with the company’s reference devices, and had the chance to run the phones through our benchmark suite. The QRD865 is a reference phone made by Qualcomm and integrates the new flagship chip. The device offers insight into what we should be expecting from commercial devices in 2020, and today’s piece particularly focuses on the performance improvements of the new generation.


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    #10147

    Anandtech: OWC Launches ThunderBay 4 Mini DAS: 4 SATA Bays With SoftRAID, Up to 1.5 G

    OWC has introduced a new small form factor high performance, high redundancy DAS for the professional market. The ThunderBay 4 Mini incorporates 4 2.5-inch storage bays, allowing it to store up to 16 TB of data, and with OWC touting transfer speeds of up to 1.5 GB/s. The device is aimed at various creative professionals who need an ample amount of reliable storage space, but in a relatively small package.
    The OWC ThunderBay 4 Mini DAS can accommodate four 2.5-inch/15.5 mm storage devices and is based on Intel’s JHL6540 (dual-port TB3) and ASMedia’s ASM1062 (PCIe 2.0 x2 => two SATA 6 Gbps bridge) controllers. Given constraints imposed by a SATA 6 Gbps interface and the ASM1062 chip, the ThunderBay 4 Mini can offer up to 1556 MB/s read/write performance when equipped with four SATA SSDs, or around 560 MB/s when populated with four Seagate’s 2.5-inch 4 TB hard drives. To ensure stable operation and consistent performance, the DAS comes equipped with a fan.
    OWC's SoftRAID
    SoftRAID XT SoftRAID XT Lite
    RAID Levels RAID 0
    RAID 1
    RAID 4
    RAID 5
    RAID 0+1
    RAID 0
    RAID 1
    Disk Certification + +
    Disk Monitoring + +
    Email Alerts + -
    Command Line Interface + -
    Tech Support Free Online Forum
    Layered on top of the hardware to provide both multi-disk performance and redundancy is OWC's SoftRAID software. OWC will offer the ThunderBay 4 Mini with either its SoftRAID XT or SoftRAID XT Lite software, depending on the model and required RAID level. The applications support both Apple macOS and Microsoft Windows operating systems, so the DAS is compatible with a wide variety of computers available today.
    OWC Thunderbay 4 Mini
    HDD Models
    SoftRAID XT
    HDD Models
    SoftRAID XT Lite
    4 TB $669.99 $599.99
    8 TB $719.99 $649.99
    16 TB $1,019.99 $949.99
    SSD Models
    SoftRAID XT
    SSD Models
    SoftRAID XT Lite
    2 TB $819.99 $749.99
    4 TB $1,149.99 $1,079.99
    8 TB $2,069.99 $1,999.99
    Enclosure Only
    SoftRAID XT
    Enclosure Only
    SoftRAID XT Lite
    0 TB $379.99 $299.99
    The barebones OWC ThunderBay 4 Mini with SoftRAID Lite XT costs $299.99, whereas a version with SoftRAID XT is priced at $379.99. Enclosures populated with SSDs or HDDs are priced depending on capacity and type of software that comes with them.
    Related Reading:


    Source: OWC


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    #10148

    Anandtech: Corsair to Acquire SCUF Gaming

    Corsair this week has announced that it will take over SCUF Gaming, a manufacturer of advanced gaming controllers for PCs and consoles. By acquiring SCUF, Corsair not only expands its products portfolio, but also gains further intellectual property and patents related to game controllers. The transaction is projected to be completed by the end of December 2019.
    SCUF's controllers are designed to shorten players' hand movements, which in turn is intended to improve their performance. Controllers from SCUF are modular: they feature removable back paddles, customizable thumbsticks, interchangeable magnetic faceplates, exchangeable D-pads, and other components that allow owners to tailor their devices for themselves.
    Corsair is not disclosing the financial terms of the private transaction, but says that SCUF will remain a separate brand within Corsair, and that SCUF will continue to operate from its headquarters in Atlanta. Since Corsair already sells mice and keyboards for gamers, SCUF will be a natural fit for the company.
    Corsair has been on acquisition spree since it sold its majority stake to EagleTree and partners in mid-2017. Last year the company took over Elgato, a maker of video capture and docking solutions, whereas this year it bought Origin PC.
    Andy Paul, founder and CEO of Corsair, said the following:
    “We are thrilled to greatly expand our portfolio of industry-leading peripherals and enter the gaming controller space to help gamers play at their best. SCUF leads the market for performance controllers and are a key ingredient to the success of countless esports professionals. SCUF will make an excellent and winning addition to the vast lineup of award-winning CORSAIR and Elgato products.”
    Related Reading:


    Source: Corsair


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    #10149

    Anandtech: ADATA Reveals XPG Hunter SO-DIMMs: Up to DDR4-3000, Up to 32 GB

    ADATA has introduced its new family of SO-DIMMs for laptops and small form-factor desktops. The XPG Hunter DDR4 SO-DIMMs offer data transfer rates of up to 3000 MT/s and capacities from 8 GB to 32 GB, allowing typical dual-channel (dual slot) systems to go up to 64 GB of RAM in total.
    ADATA’s XPG Hunter DDR4 SO-DIMMs are based on cherry-picked memory chips as well as high-quality PCBs. Like other enthusiast-class memory modules, the XPG Hunter SO-DIMMs feature XMP 2.0 SPD profiles to make it easier to set the correct speed settings. Also, to maximize stability, the modules come equipped with heat spreaders.
    The XPG Hunter SO-DIMMs are set to be available in 8 GB, 16 GB, and 32 GB sizes and will be rated for DDR4-2666 CL18 and DDR4-3000 CL17 at 1.2 V operation.
    ADATA's XPG Hunter SO-DIMMs
    Size Latency Voltage
    DDR4-2666 8 GB CL18 18-18 1.2 V
    DDR4-2666 16 GB
    DDR4-3000 8 GB CL17 19-19
    DDR4-3000 16 GB
    DDR4-3000 32 GB
    ADATA did not announce MSRPs for its XPG Hunter DDR4 memory modules, but considering the fact that we are not dealing with SO-DIMMs designed for extreme PCs, it is unlikely that the new modules will be particularly spendy.
    Related Reading:


    Source: ADATA


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    #10150

    Anandtech: Samsung to Expand 3D NAND Fab in China

    Samsung reportedly plans to invest billions of dollars to expand its 3D NAND production facility in Xian, China. If the company proceeds with the plan, bit production capacity of the fab would increase significantly.
    According to Chinese media, the world’s largest supplier of NAND flash memory reportedly intends to spend $8 billion on expansion of its fab in Xian. Back in 2017, Samsung already announced plans to invest $7 billion over the following three years to boost the production capacity of its Xian facility, so the new investment will be spent on a third expansion of the fab.
    Physical expansion of the Xian production facility will allow Samsung to further increase its 3D NAND bit output, giving Samsung more physical capacity and helping to offset the longer and more intensive manufacturing process required for high layer counts in 3D NAND. According to a media report, Samsung's Xian fab can now process 120,000 wafer starts per month. After the expansion, it will reportedly increase its output to 130,000 wafer starts per month, but it is likely that these will be 3D NAND wafers with a higher number of layers.
    Samsung has not formally confirmed the $8 billion investment plan, but earlier this year the company indicated that it would be ‘flexible’ in expanding the Xian production facility.
    Samsung currently produces 3D NAND at three sites: in Hwaseong and Pyeongtaek in South Korea and Xian in China.
    Related Reading:


    Sources: Reuters, Pulse News



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