Thread: Anandtech News

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    #11231

    Anandtech: MinisForum Unveils Cezanne EliteMini HX90 and Tiger Lake EliteMini TL50 mi

    MinisForum, a Shenzhen based manufacturer of compact computing platforms, has been steadily bringing both AMD and Intel-based systems into the market. While the mix has mostly involved platforms that are a couple of generations old (allowing for competitive customer pricing), the company releases products based on the latest processors occasionally. Recently, the company sent across details of two of their 2021 introductions - the EliteMini TL50, and the EliteMini HX90. The TL50 is based on an Intel Tiger Lake-U processor, while the HX90 is based on an AMD Cezanne Zen 3 notebook APU.
    The HX90 is the more interesting of the lot - MinisForum has managed to source the top-end APU, the AMD Ryzen 9 5900HX, for the system. The TL50, on the other hand, comes only with the Intel Core i5-1135G7. The TL50 also uses a highly-integrated motherboard with soldered LPDDR4 DRAM (12GB), but the M.2 NVMe SSD the only upgradable component. In fact, the company only offers one configuration with 12GB of soldered DRAM and a 512GB SSD pre-installed with Windows 10 Professional. The form-factor is slightly bigger than the mainstream UCFF NUCs with the 1.2L box including support for the installation of two 2.5" drives. The TL50 is available for shipping today and is priced at $649.
    The HX90, on the other hand, uses a 45W TDP notebook processor, and hence comes with additional cooling requirements. The form factor is correspondingly larger, and the system has a 2.2L volume footprint. The key seller here is the Ryzen 9 5900HX APU which delivers gaming capabilities not found in other systems of similar size / cost. MinisForum is also promising a carbon fibre-infused chassis for a premium look. Unlike the TL50, the RAM is upgradable. Other differences are brought out in the table further down.
    The barebones version of the HX90 is currently priced at $629, which apparently includes a $100 early-bird discount (the units aren't slated to ship until September).
    MinisForum EliteMinis (Cezanne and Tiger Lake)
    Model HX90 TL50
    CPU AMD Ryzen 9 5900HX
    Cezanne (Zen 3), 8C/16T
    3.3 - 4.6 GHz
    45W TDP (35W-54W cTDP)
    Intel Core i5-1135G7
    Tiger Lake-U, 4C/8T
    2.4 - 4.2 GHz
    28W TDP
    GPU AMD Radeon Graphics 8CU @ 2.1 GHz (Integrated / On-Die) Intel® Iris Xe Graphics @ 1.3 GHz (Integrated / On-Die)
    Memory 2x DDR4-3200 SODIMMs
    1.2V, 64GB max.
    LPDDR4 12GB (Soldered)
    Motherboard 7.5" x 7" Custom 5.5" x 5.5" Custom
    Storage 1x M.2 2280 (key M) PCIe 3.0 x4 NVMe/AHCI SSD
    2x SATA3 2.5" HDD / SSD
    2x M.2 22x42/80 (key M) SATA3 or PCIe 3.0 x4 NVMe/AHCI SSD
    I/O Ports 1x USB 3.2 Gen 1 Type-A (front)
    1x USB 3.2 Gen 1 Type-C (front)
    4x USB 3.2 Gen 1 Type-A (rear)
    1x Thunderbolt 4 (front)
    2x USB 3.2 Gen 1 Type-A (front)
    2x USB 3.2 Gen 1 Type-A (rear)
    2x USB 2.0 Type-A (rear)
    Networking Intel Wi-Fi 6 AX200
    (2x2 802.11ax Wi-Fi + Bluetooth 5.1 module)
    1 × 2.5 GbE port
    Intel Wi-Fi 6 AX200
    (2x2 802.11ax Wi-Fi + Bluetooth 5.1 module)
    2 × GbE ports
    Display Outputs 2x DP 1.4a
    2x HDMI 2.0b
    1x DP 1.4a (rear)
    1x HDMI 2.0b (rear)
    1x DP 1.4a (via Thunderbolt 4, front)
    Audio 7.1 digital (over HDMI and DisplayPort)
    L+R+mic (front)
    L+R+mic (rear)
    7.1 digital (over HDMI and DisplayPort)
    L+R+mic (front)
    Enclosure Carbon fibre-infused plastic / Kensington lock Plastic / Kensington lock
    Power Supply 120W (19V @ 6.3A) Adapter 65W (19V @ 3.42A) USB Type-C (adapter included)
    Dimensions 195mm x 190mm x 60mm / 2.22L 149.6mm x 149.6mm x 55.5mm / 1.2L
    Miscellaneous Features VESA mounting plate VESA mounting plate
    Pricing Barebones ($629 - $729)
    16GB RAM + 256GB SSD ($799 - $899)
    16GB RAM + 512GB SSD ($829 - $929)
    32GB RAM + 512GB SSD ($909 - $1009)
    12GB RAM + 512GB SSD ($649 - $699)
    Both PCs look a bit weak in terms of I/O capabilities compared to other mini-PCs in the market - while the TL50 does include a Thunderbolt 4 port and dual gigabit LAN ports, the HX90 has only 1x 2.5G BASE-T port and the USB ports are all Gen 1 (5Gbps). The HX90 does support four simultaneous 4Kp60 display outputs, while the TL50 only supports three such displays. The target markets are slightly different, as the TL50 is meant for home / office scenarios, while the HX90 falls under the gaming mini-PC line. Having had hands-on experience with multiple MinisForum units in the past, my impression of the brand is generally favorable unlike the host of other no-name Shenzhen-based sellers typically found on Amazon. In general, I would recommend the barebones version of their systems when possible - similar to a lot of other system vendors, the pre-built configurations come with only one DRAM slot occupied, leaving significant performance potential untapped.


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    #11232

    Re: Anandtech: JEDEC Publishes LPDDR5X Standard at up to 8533 Mbps

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    #11233

    Anandtech: ASRock Z590 Steel Legend WiFi 6E Review: Z590 On A Budget

    Over the past six months we've looked at a varied selection of Z590 motherboards. While most of these have been in the mid-range to premium category, today we are taking a look at a more modest and cost-effective Z590 model. The Z590 Steel Legend WiFi 6E sits toward the lower end of ASRock's Z590 offerings. It combines a varied feature set that includes 2.5 gigabit Ethernet, Intel's latest Wi-Fi 6E CNVi, three M.2 slots, all while adopting a unique urban camouflaged PCB design. We give the Z590 Steel Legend our attention and see if budget Z590 has its limitations or if it's money well spent.

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    #11234

    Anandtech: Open Compute Project: An Interview with Intel's Rebecca Weekly

    When Facebook was scaling its technologies and pivoting to completely public use in the late 2010s, it started an internal project around data efficiency and scalability. The goal was to end up with a solution that provided scalable resources, efficient compute, and enabled cost savings. In 2011, combined with Intel and Rackspace, the Open Compute Project was launched to enable a set of open standards that could benefit all major industry enterprise players. OCP is also a fluid organization, providing its community a structure that is designed to enable close collaboration on these evolving standards, pushing for 'commodity hardware that is more efficient, flexible and scalable, throwing off the shackles of proprietary one-size-fits-all gear'. OCP also has a certified partner program, allowing external customers to be part of the ecosystem that covers data center facilities, hardware, networking, open firmware, power, security, storage, telecommunications, and future technologies.
    In this interview today we have Rebecca Weekly, who not only sits as the VP and GM of Intel's Hyperscale and Strategy Execution, but is also an Intel Senior Principal Engineer. However, today we are speaking to her in her role as Chairperson and President of the Board of the Open Compute Project, being promoted on July 1st of 2021.

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    #11235

    Anandtech: ASUS TUF Gaming Z590-Plus WIFI Motherboard Review: Is $260 Mid-Range or Hi

    Despite the Z590 chipset being the premium option for Intel 11th Gen Rocket Lake processors, and the boards starting around $200, not every model is there to decimate the wallet. Every vendor has models designed for entry-level, mid-range, and even the flagship models - it's all a question of where the vendor thinks those delineated markets are. Some boards certainly have eye-watering prices attached to them, for example. Focusing on the mid-range segment, today we're taking a look at the ASUS TUF Gaming Z590-Plus WIFI. Its most prominent features include three M.2 slots, USB 3.2 G2x2 Type-C support, and a solid pair of networking controllers, including Wi-Fi 6E and 2.5 Gigabit Ethernet. The sub $300 Z590 market is awash with options for users, but does ASUS hold the key to unlocking Rocket Lake's potential at what it thinks is a reasonable price? Let's find out.

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    #11236

    Anandtech: NVIDIA Announces RTX A2000 Video Card: Low Profile & Low Power for ProViz

    As part of a suite of SIGGRAPH-related announcements, NVIDIA this morning is announcing a new addition to their RTX line of professional video cards, the RTX A2000. Following NVIDIA’s transitional top-to-bottom product rollouts, the latest member of NVIDIA’s pro GPU lineup is the smallest and cheapest card yet, thanks in large part to its use of NVIDIA’s GA106 GPU. Paired with 6GB of VRAM and aimed in part at small form factor workstations, NVIDIA expects the card to go on sale in October.


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    #11237

    Anandtech: Samsung Unpacked 2021 Part 2: Galaxy Z Flip 3 & Z Fold 3 Announced

    Today Samsung is holding its second Mobile Unpacked event for the year, announcing the new Galaxy Z Flip 3 and the new Galaxy Z Fold 3.

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    #11238

    Anandtech: Silverstone MS12 and Yottamaster HC2-C3 USB 3.2 Gen 2x2 20Gbps Enclosures

    Late last year, we took stock of the the state of the USB 3.2 Gen 2x2 ecosystem. It was not a rosy outlook at that time. But since then, many vendors have introduced new products in the 20 Gbps-performance class, and host support has also started to look up. A few new enclosures in this speed class have also appeared in the market.
    In parallel, we have seen 3D NAND layer counts go up and QLC become more prevalent. Capacities of SSDs and external bus-powered direct-attached storage (DAS) devices have increased, with 4TB being offered by almost all vendors. Consumer trends in terms of DAS workloads has also undergone some shifts.
    To that end, today we're going to take a fresh look at the market for 20Gbps external storage enclosures, thanks to some new enclosures as well as our new DAS test suite. Read on for a detailed look at our new direct-attached storage testing infrastructure, along with the evaluation results from our first set of evaluated products - the Silverstone Tek MS12 and the Yottamaster HC2-C3 USB 3.2 Gen 2x2 20Gbps NVMe SSD enclosures.

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    #11239

    Anandtech: HONOR Announces Magic 3 Series: With Snapdragon & Google, A new Start

    Today, we see HONOR announce the company’s new flagship Magic 3 series of devices. The new Magic 3 series consists of 3 new phones, the “regular” Magic 3, the Magic 3 Pro, and the Magic 3 Pro+.

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    #11240

    Anandtech: Zotac ZBOX MAGNUS ONE SFF Gaming PC Review: Desktop Comet Lake Charges Up

    Zotac has been a pioneer in bringing compact small form-factor (SFF) machines to the market right since the ION days. A few years back, they also got into the other expanding PC market segment - gaming systems - using the same SFF approach. With the burgeoning market for compact systems (kickstarted by the success of the Intel NUC initiative), Zotac has grown from strength to strength. The company now has around 8 different mini-PC families targeting different segments. The ZBOX E series caters to the gaming crowd and is marketed under the MAGNUS tag. The company's current flagship is the ZBOX MAGNUS ONE (introduced at the 2021 CES). Coupling a desktop Comet Lake CPU with an nVIDIA Ampere GPU, it promises plenty of gaming prowess. Read on for a detailed look at the performance and value proposition of the top-end ZBOX MAGNUS ONE model - the ZBOX-ECM73070C-W2B.


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