Thread: Anandtech News

Industrial PCs are meant for 24x7 deployment in a wide range of environments. This brings in a host of requirements such as wide operating temperature range, ruggedness, regulatory requirements, support for specific I/O types, etc. Most industrial PCs are passively cooled, with the absence of moving parts contributing to better reliability. In certain cases, processing power requirements and space constraints make it necessary to include active cooling. Today, we are looking at a high-end industrial PC from Cincoze - the DS-1300 featuring a Comet Lake-based Xeon CPU and a discrete GPU. Read on to for a detailed look at the features and performance profile of the flagship member of the Cincoze DS-1300 series.

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Mushkin's lineup of PCIe 4.0 SSDs has largely remained a Phison affair. The Delta series was based on the Phison E16 and the Gamma on the Phison E18. Recently, the company launched a new series of PCIe 4.0 SSDs - the Redline VORTEX. The key here seems to be the usage of a new SSD controller - the Innogrit Rainier IG5236. It appears to be taking over the flagship mantle from the Gamma - besting it in both read and write random access IOPS and also sequential read speeds. However, unlike the Delta and Gamma, which came to the market in 1TB, 2TB, and 4TB flavors, the Redline VORTEX series has three capacity points - 512GB, 1TB, and 2TB. Detailed specifications are provided in the table below.

Mushkin Redline VORTEX SSD Specifications
Capacity	512 GB	1024 GB	2048 GB
Controller	Innogrit IG5236
NAND Flash	?? 3D TLC NAND
Form-Factor, Interface	Single-Sided M.2-2280, PCIe 4.0 x4, NVMe 1.4
DRAM	512 MB DDR4	1 GB DDR4	2 GB DDR4
Sequential Read	6750 MB/s	7430 MB/s	7415 MB/s
Sequential Write	2635 MB/s	5300 MB/s	6800 MB/s
Random Read IOPS	200K	390K	730K
Random Write IOPS	645K	1085K	1500K
SLC Caching	Yes
TCG Opal Encryption	No
Warranty	5 years
Write Endurance	250 TBW 0.27 DWPD	500 TBW 0.27 DWPD	1000 TBW 0.27 DWPD
MSRP	$78 (15.23¢/GB)	$125 (12.21¢/GB)	??

The SSD adopts a graphene heat dissipating label for its thermal solution - typical for the price point targeted. The performance numbers (aided by dynamic SLC caching) make it sitable for content creation and gaming - workloads that typically benefit from the capabilities provided by PCIe 4.0 SSDs.

Mushkin is not the first to market with the Innogrit Rainier controller. The Patriot Viper VP4300 series and the ADATA XPG GAMMIX S70 Blade were introduced late last year. While the Viper VP4300 is priced quite high, the Mushkin Redline VORTEX manages to undercut the XPG GAMMIX S70 blade by $12 at the 512GB capacity point and $5 at the 1TB point (based on current street pricing). The company is yet to announce availability and pricing for the 2TB SKU. The appearance of more affordable PCIe 4.0 NVMe SSDs in the market is good news for consumers.



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There's been a lot of focus on how both Intel and AMD are planning for the future in packaging their dies to increase overall performance and mitigate higher manufacturing costs. For AMD, that next step has been V-cache, an additional L3 cache (SRAM) chiplet that's designed to be 3D die stacked on top of an existing Zen 3 chiplet, tripling the total about of L3 cache available. Now AMD's V-cache technology is finally becoming available to the mass market, as AMD's EPYC 7003X "Milan-X" server CPUs have now reached general availability.
As first announced late last year, AMD is bringing its 3D V-Cache technology to the enterprise market through Milan-X, an advanced variant of its current-generation 3rd Gen Milan-based EPYC 7003 processors. AMD is launching four new processors ranging from 16-cores to 64-cores, all of them with Zen 3 cores and 768 MB of stacked L3 3D V-Cache.

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To bring digital-camera imaging quality to its new smartphones even in challenging captures like high-contrast, low-light, and motion, rather than look for or develop an alternative to established mobile-device CPUs, Global consumer electronics and mobile communications company OPPO designed the new MariSilicon X imaging NPU (Neural Processing Unit) chip.
MariSilicon X combines neural processing hardware with an ISP ("Image Signal Processor") and a multi-tier memory subsystem into a dedicated component between the smartphone's cameras and CPU. This lets MariSilicon X run machine learning and AI algorithms many times faster and with a fraction of the energy of previous approaches. The result: jaw-dropping computational photography improvements including superior night and low-light videos, with crisp detail and better color reproduction. OPPO is premiering MariSilicon X and the imaging benefits it brings in its brand-new Find X5 Series smartphones.

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Depending on your point of view, the last two years have either gone by very slowly, or very quickly. While the COVID pandemic never seemed to end – and technically still hasn’t – the last two years have whizzed by for the tech industry, and especially for NVIIDA. The company launched its Ampere GPU architecture just two years ago at GTC 2020, and after selling more of their chips than ever before, now in 2022 it’s already time to introduce the next architecture. So without further ado, let’s talk about the Hopper architecture, which will underpin the next generation of NVIDIA server GPUs.
As has become a ritual now for NVIDIA, the company is using its Spring GTC event to launch its next generation GPU architecture. Introduced just two years ago, Ampere has been NVIDIA’s most successful server GPU architecture to date, with over $10B in data center sales in just the last year. And yet NVIDIA has little time to rest on their laurels, as the the growth and profitability of the server accelerator market means that there are more competitors than ever before aiming take a piece of NVIDIA’s market for themselves. To that end, NVIDIA is ready (and eager) to use their biggest show of the year to talk about their next generation architecture, as well as the first products that will implement it.
Taking NVIDIA into the next generation of server GPUs is the Hopper architecture. Named after computer science pioneer Grace Hopper, the Hopper architecture is a very significant, but also very NVIDIA update to the company’s ongoing family of GPU architectures. With the company’s efforts now solidly bifurcated into server and consumer GPU configurations, Hopper is NVIDIA doubling down on everything the company does well, and then building it even bigger than ever before.


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Long expected from Intel, the Core i9-12900KS is now out of the bag thanks to an apparently accidental listing from Newegg. The major PC parts retailer listed the uannounced Intel chip for sale and began taking orders earlier this morning. pulling it a couple of hours later. But with the scale and popularity of Newegg – as well as having the complete specifications posted – the cat is now irreversibly out of the bag.

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Back in January during their CES 2022 keynote, NVIDIA teased the GeForce RTX 3090 Ti, an even more powerful version of NVIDIA’s flagship card for the high-end gaming and content creation markets. At the time, NVIDIA told us to expect more information later in January, only for January (and February) to come and go without further mention of the card. But now, in the waning days of March, the GeForce RTX 3090 Ti’s day has come, as NVIDIA is launching their new flagship video card today.

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Since Intel announced and launched its 12th Gen Core series of CPUs in to the market, we've reviewed both the flagship Core i9-12900K, as well as the entry-level (but still very capable) Core i3-12300 processors. Today, we're looking at the middle of the stack, with the Core i7-12700K and Core i5-12600K both taking center stage.
Ever since AMD launched its Zen 3 architecture and its Ryzen 5000 series for desktop, Intel has been playing catch up in both performance and pricing. Intel's hybrid Alder Lake design is its second attempt (Rocket Lake) to dethrone Ryzen 5000 as the go-to processor for consumers building a high-end desktop system for gaming, content creation, and everything in between. It's time to see if the Core i7-12700K and Core i5-12600K can finally level the playing field, if not outright give Intel an advantage in the always popular mid-range and enthusiast markets.


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A few weeks ago we had a look at ADATA's first attempt into the PC Power Supply market with the Cybercore PSU. In today's review we are checking out another of their diversification attempts, this time towards the CPU cooling market, in the form of the XPG Levante 360 all-in-one liquid cooler. Heavily based on an Asetek reference design, the XPG Levante 360 is a very well performing and well built cooler, but it struggles to stand out in a commodity market full of CPU coolers.

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The hottest advancement in memory technology for desktop computers in recent years is undoubtedly the release of DDR5 memory and Intel's 12th Gen Core series of processors. Not only does DDR5 memory yield higher memory bandwidth for many different use cases, but DDR5 also offers a generational increase in memory capacity, allowing for higher capacity UDIMMs over time.
But, as always, the memory market is anything but homogenous. Even with just three actual DRAM manufacturers, DIMM vendors are offering DDR5 at a slew of clockspeeds, both official JEDEC speeds and X.M.P. profile memory that essentially comes overclocked out of the box. There are also notable differences in today's common DDR5 DIMM configurations, including single-sided UDIMMs (1Rx8), and dual-sided memory (2Rx8), as well as UDIMMs with different capacities.
In today's piece, we're looking at DDR5-4800 memory from Samsung, including 2 x 32 GB, 2 x 16 GB, and 4 x 16 GB, to measure the performance differences between single and dual rank memory, as well as any differences between running DDR5 in one DIMM Per Channel (DPC) or two. Finally, as we have DDR5-4800 DIMMs with DRAM from Micron and SK Hynix, too, we'll also be looking at these in our results, to see if there are any performance differences among the three memory manufacturers.

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