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Thread: Anandtech News

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    #3211

    Anandtech: Understanding Panel Self Refresh

    Earlier today Brian spent some time with the G2, LG's 5.2-inch flagship smartphone based on the Qualcomm Snapdragon 800 (MSM8974) SoC. I'd recommend reading his excellent piece in order to get all of the details on the new phone, but there's one disclosure I'd like to call out here: the G2 supports Panel Self Refresh.
    To drive a 60Hz panel, your GPU must present the display with the contents of the frame buffer 60 times per second. Regardless of what's being displayed (static vs. active content), every second there are 60 updates pushed from the GPU to the display. When displaying fast moving content (e.g. video playback, games, scrolling), this update frequency is important and appreciated. When displaying static content however (E.g. staring at the home screen, reading a page of an eBook), the GPU is consuming power sending display updates when it doesn't need to. Panel Self Refresh (PSR) is designed to address the latter case.
    To be clear, PSR is an optimization to reduce SoC power, not to reduce display power. In the event that display content is static, the contents of the frame buffer (carved out of system RAM in the case of a smartphone) are copied to a small amount of memory tied to the display. In the case of LG's G2 we're likely looking at something around 8MB (1080p @ 32bpp). The refreshes then come from the panel's memory, allowing the GPU (and SoC) to drive down to an even lower power state. Chances are the panel's DRAM is also tied to a narrower bus and can be lower power than the system memory used by the SoC, making these refreshes even lower in power cost.
    LG claims a 26% reduction in power when displaying a still image with PSR enabled. I'm curious to see the impact on overall battery life. There are elements of our WiFi web browsing test that could benefit from PSR but it's unclear how much of an improvement we'll see. The added cost of introducing additional memory into a device is something that panel vendors have been hesitant to do, but as companies look to continue to reduce platform power it's a vector worth considering. LG's dual-role as a component supplier and device maker likely made the decision to enable PSR a lot easier.

    PSR potentially has bigger implications for notebook use where it's not uncommon to just stare at a desktop that's not animating at all. I feel like the more common use case in smartphones is to just lock your phone/display when you're not actively using it.



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    #3212

    Anandtech: Nokia Lumia 521: Quality Smartphone on an Extreme Budget

    The Nokia Lumia 521 is very interesting. It’s the T-Mobile US version of the Lumia 520, and ships with AWS HSPA+ for just $129 sans contract or subsidy. It’s nearly identical to the 520 save for very minor dimensional differences and T-Mobile branding. AT&T gets the 520 in its original form as part of their GoPhone prepaid lineup for $99.99, no contract. The specsheet reads pretty respectably given the budget—Qualcomm’s MSM8227 SoC with dual-core Krait at 1GHz clocks, Adreno 305 graphics, 512MB RAM, 8GB of onboard NAND plus a micro SD slot, a 4” WVGA IPS panel, and a 5MP camera with an f/2.4 lens. And of course, this being Nokia, you’re assured of a pretty decent design and build. Nokia has always excelled at building durable, inexpensive handsets that didn’t feel cheap, which is one of the things that has propelled them to success in developing markets.


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    #3213

    Anandtech: Xbox One: Unboxed

    We’ve already discussed the hardware of the Xbox One (or Xbone as Brian likes to call it) and compared it with the PlayStation 4, so all that’s left is the official launch, a bunch of day one unboxing videos from excited early adopters, and then the games (and hopefully no RRoD). Oh, wait—scratch that second one off the list, because Microsoft has beat them all to the punch with their very own unboxing video, three months ahead of the official launch. Xbox’s Major Nelson does the honors, and you get a thorough rundown of the contents. In order of unboxing, we get:

    • New and improved Kinect sensor, with a wider field-of-view
    • Mono headset with inline audio controls
    • Xbox One controller
    • 4K rated HDMI cable
    • Manual, paperwork, and a sticker (woohoo!)
    • Power cord and power brick
    • “Liquid black” (aka glossy) Xbox One console

    There’s nothing particularly unexpected in there, other than perhaps getting a headset for both the Day One and standard releases. Major Nelson also goes over the I/O ports. On the left side are a single USB 3.0 port and a binding button (for setting up your controllers). On the rear you get HDMI Out, S/PDIF, HDMI In (for cable/satellite pass-through), two more USB 3.0 ports, the Kinect socket (note that Kinect can function as an IR Blaster), an IR Blaster port, Gigabit Ethernet, and even a Kensington security lock—the power connector is at the left of the rear. There are also some changes to the controller, with Day One 2013 printed on the first controllers.
    We’ve covered the other features previously, but just to recap, the Xbox One comes with an 8-core AMD Jaguar CPU, 12CU/768 SP AMD GCN GPU, 8GB DDR3 RAM, 500GB HDD, Blu-ray drive, and dual-band 802.11n WiFi. I’m guessing it’s a 2x2:2 MIMO implementation, but there’s no official word on this yet. Sadly, there won’t be any 802.11ac for the initial models it looks like. All this, for a not insignificant $499 MSRP come November 2013.



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    #3214

    Anandtech: The 2013 MacBook Air Review (11-inch)

    Apple launched their new Haswell based MacBook Air laptops last month, and we started our reviews with the MacBook Air 13. Today we have the review of it's smaller sibling, the MacBook Air 11. How does it fare as a laptop, and can you make the case for carrying one of these around in place of a tablet? Read on as we discuss these and other questions in our full review.


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    #3215

    Anandtech: Interview with Jackson Hsu, Product Management Director at GIGABYTE

    Interview with Jackson Hsu,
    Product Management Director at GIGABYTE


    As part of our trip to Computex this year, alongside a good look around the GIGABYTE Taipei 101 VIP Suite and the GIGABYTE OC Lab, we were given the opportunity to interview Mr. Jackson Hsu, Deputy Division Director for the Motherboard Business Unit at GIGABYTE – or as Jackson more accurately described in our interview, ‘Product Management Director’. Jackson is the glue that binds the different areas of GIGABYTE together – research/development, sales, marketing, QA and so on, and thus whatever ideas that each department has for new product designs, each element that needs communication between segments goes through Jackson.
    I would like to thank Jackson and GIGABYTE for the interview, especially as English is not Jackson's first language.
    Ian Cutress: Hi Mr. Hsu, many thanks for agreeing to this interview with AnandTech.
    Jackson Hsu: No Problem!
    IC: To start, can you tell us a little about yourself?
    JH: My name is Jackson Hsu, and my business card tells me I am ‘Deputy Division Director’, but sometimes it is not easy to translate the position from Chinese to English - I am in charge of the Product Management Team (to be simple), and more on the R&D side.
    IC: How long have you been in this position?
    JH: I joined GIGABYTE in July 1999 (14 years) as an FAE (Field Application Engineer) for six years, where I was handling channel and OEM customers and in charge of the FAE team for 3 or 4 years before transferring to the PM (Product Marketing) team and my current position. So about half and half!
    IC: What history (academic and career) has led you to your current position?
    JH: I spent a year in Mechanical Engineering at university, before switching to Electrical Engineering in the second year. I then served in the Taiwanese military after university for two years, before joining FIC for another two years in the notebook R&D team – validation of panels, hard drives, batteries etc. And then I joined GIGABYTE.
    IC: Can you explain a little about your position at GIGABYTE?
    JH: My position involves ensuring good communication between sales, R&D, marketing, customers, media, production and power users.
    IC: So you are the head that talks to all these parts?
    JH: I am more like a bridge! So when I get Sales feedback such as ‘we want this product’, I make sure that R&D know exactly what sales require, and when. There is a lot of back and forth and I make sure that the communication goes smoothly. I sometimes speak to the factory on the production side, but only if there is a problem or some quality issues or special testing on models.
    IC: Can you describe a typical day?
    JH: Meetings! Meetings and meetings and meetings.
    IC: Is that meetings between departments to make sure everything goes smoothly?
    JH: Absolutely - meetings with sales, R&D, or the boss! It is all about products.
    IC: Do you have a chance to personally influence new products coming to the market?
    JH: I think I do, but I have the chance to explain in detail to both sides (sales/R&D) about how features should benefit. Say for example Sales has a good feature, and if I think it is good, I need to persuade R&D that it is good as well. But when I get feedback from media and power users about certain features, I will talk to all sections if it is possible. Of course I always report back to top management for the final confirmation.
    IC: How do you deal with ideas from Sales, Marketing, R&D, etc.?
    JH: A lot of ideas come through from sales due to speaking with customers and getting feedback on previous ideas. Also when sales are dealing with customers and the customers note that competitors have beneficial features then it all flows back through the system if we do not have it. Power Users and Media who manage to test a large number of products and features from all companies also come back with what they think are the best features. On the vendor side (Intel, AMD, Component IC manufacturers) also come to us with their roadmaps about upcoming components and new features which we then have to decide whether a user might want them. The R&D guys also have their own ideas which get passed through to marketing and sales to see if they will sell. If you take the OC boards from this year – it is all HiCookie’s ideas! He is experienced, and it helps that both R&D and sales both trust him. I have to double check to make sure this is exactly what he wants!
    IC: A lot of sales is getting feedback from system integrators and end-users. How much does end-user feedback get into the development process?
    JH: If many users feedback the same issues then it is easy – it is all a question of numbers. If it is feedback of a specific feature then we ask each division to look at it; it is not just one person or one department that makes the decision. We will all meet to see if it is a doable idea or a crazy idea – it might be possible at a later date but generally several departments will offer their feedback. Sometimes sales does have the pressure of the cost even if it is a good feature, so there is always fighting between various departments.
    IC: In terms of platform roadmaps, when do you start looking at that next generation of products?
    JH: Generally we start looking about a year before. We started working with Haswell over a year ago, and Intel was good to provide plenty of information well before the launch such that we were able to study the materials and the specifications. We were also making CRBs (Customer Reference Boards) for Intel so that helps us experience the new platform a little earlier.
    IC: Could you break down those twelve months in terms of product design, planning and production?
    JH: Working backwards from the launch and using the 8-series as an example: we need to get the motherboards in the channel for stocking, and a large portion of that is when the component vendors supply the ICs such as chipsets. For example if we get the chipset two or one month early, then we need to get all the materials before that. We will probably get our materials ready by April (two months before launch). That means all the materials will be in the factory by that time (VRMs, PCBs, Heatsinks etc). If we are able to do it by that time this means that all the validation is finished for base production – the lead time for this is 4-5 weeks, and then one week for production. This means that by early March all the design validation has been completed. At that time everything should be closed in terms of hardware/product segmentation and hardware validation – of course the BIOS and software can still be updated. Counting back from March, we go into a normal EVT/DVT cycle – first engineering samples and second engineering samples, so the design cycle should take 4-5 months (starting back in October/November) but sometimes we can be rushed, such as the C1/C2 issue.
    IC: Does that mean you have to revalidate everything on C2?
    JH: Everything on the chipset has to be revalidated. The discussion the number of SKUs and specifications is then performed earlier, most likely in the September/October timeframe. In order to discuss all that, Intel provides information a lot earlier, so we will study all the documentation during 12-18 months before the launch.
    IC: So in terms of Ivy Bridge-E, you will be doing final validation about now?
    JH: Ivy Bridge-E has the benefit of being the same socket as Sandy Bridge-E, so we normally revalidate the CPU and BIOS, making sure the drivers work. The new BIOS and material should be going onto the website when we are allowed to. If we have a new SKU it would only be a couple of models, nothing as large as the 8-series.
    IC: Say you get a request from a specific market - for example China wants a motherboard for internet cafés and they want 10,000 units. What happens then?
    JH: In that situation we will aim to provide. Take for example our 8-series this time around – at the time of launch we have 33 models. You can imagine that not every country is buying every model of motherboard! So each market will pick what they want and what they need, or they will ask for specific features when we are designing our motherboards (for example iCafe). For example some Latin America customers and European customers are getting this treatment.
    IC: In terms of goals for GIGABYTE after the launch of 8-series – I hear that sales figures with ASUS are close, and with the motherboard market predicted to shrink in 2013. Where does GIGABYTE want to be in the next 12 months/5 years?
    JH: For the next 12 months it is easier to say – we want to get more market share in the mainstream and high end markets. For the 5 year prediction, we need to compete with others in the growing segments such as notebooks and tablets, so we need to make our products more attractive. We need to help people see that PCs are still required – for example, for us the tablets and phones are getting more shares, and users need the PC at home for a data center/ synchronization. We need to make our products more ‘easy to use’, which is a big goal that everyone is trying to figure out how to do it, especially from our background as a motherboard component manufacturer we need to learn how to provide more than just a motherboard.
    IC: What recent GIGABYTE innovations have particularly pleased you?
    JH: Speaking about the 8-series, we tried mainly to improve the user experience. As an example the OP-AMP technology is not from GIGABYTE – it is already there in the HiFi market. I believe that it has been done before in that market, but we studied it and looked more into a solution that is easier for users as well as more beneficial. Take for example the audio solution we put on the gaming motherboards on Z87 - we will soon provide the same solution on B85, H81 and A85X. We will be pushing such features down from the high-end to the mainstream and even to the entry because we think it is such a good feature that our customers will be able to pick their choices at various price points. The good thing that we do is that we learn from others and change the combination a little bit and then we make it better. Take for example our Gaming Series motherboards – we are using the best Creative Sound Core3D which we have used before. The entire design path to the OP-AMP and audio capacitors and the audio ground protection to the golden plated shield and audio jacks – the whole path is taken care of. So some power users asks ‘Why you don’t put that AMP in the front audio path?”, but we found it is very difficult to control the front audio cable which is bundled in the chassis, and we cannot control the quality of that cable to we cannot guarantee the best experience so we focus on the rear audio. We know it is not the easiest to use but by using it we can guarantee the experience. Perhaps the next step is trying to figure out a way to improve the front panel audio situation! What I mean is that we see every segment along the path and try and find a way to make it better.
    The second thing is on the OC boards - all the features are designed to make overclocking easy, and thus making the user experience better. Also our software and BIOS has had a big change – we unified the UI, the color scheme, the layout is very similar and we are making our first GIGABYTE apps so that the customer only has to install one main program and the system will auto update. We know it is not perfect yet but it is all about user experience.
    IC: In terms of GIGABYTE’s current product stack, what do you feel you would want promoted more? What needs more of a big push into a product win?
    JH: We try and put more effort into gaming platforms, such as the expansion of our G1 series down into the lower price brackets to see if our customers enjoy it. That seems to be a major target for us this year. But the whole 8-series is still our major focus – we like to talk about gaming and the OC series, but we also improve our classic (channel) series in terms of user experience such as fan control, fan headers, power delivery. If we get an idea for a new feature that is not cost-sensitive then we try and apply it across our product line.
    IC: What innovation should GIGABYTE is looking for in the future? I know you can’t tell me about anything secret you have down in R&D, but in a market where innovation seems to grab sales, it would be good to hear your thoughts.
    JH: I think one of the most important features should be how we connect our products to the high volume selling products in technology, such as smartphones and tablets. That is one direction to look at but it is not easy – how do you figure out how to create a feature that makes a user’s life easier? But then of course we have to focus on performance and user experience. Our goals are always towards both performance and user experience.
    IC: In terms of the market, do you think there is a gap that GIGABYTE should be moving into?
    JH: I think the market is pretty mature, but it is just a matter of how ‘good’ the product is.
    IC: A few of our readers interested in the computer industry are still at school. Say for example you are a high school student, and you wanted to work in the tech industry – what experience should this age group be doing and would it best to study in Taiwan as well as learning Chinese?
    JH: It is important to understand there are many different features in the tech industry – such as sales or R&D. At this age it the student might not know exactly what they want. But in the PC industry you need to know about PC technology – you need to know the trends and you need to know how to work with the components. The more knowledge you have, the more beneficial to the industry you are. If you want to hire a freshman out of college, then if he has more knowledge on the technical background it will shorten the training time on the technical side. The personality and the attitude of the individual is also important – they have to be willing to learn rather than focus on earning money. I know for the first few years that ambition is always important. Studying in Taiwan is not necessary – for example I did not study in Taiwan.
    IC: If you were not working at GIGABYTE, where would your preferred place of employment be?
    JH: Good question, I couldn’t tell you! If I was not in the PC hardware industry, perhaps Google! A company that is always expanding and innovating would be good.
    IC: For your position at GIGABYTE, do you work a typical 9-5, or does it involve evenings and weekends?
    JH: It can be both. My working day is often full of meetings, so you do not have much time to reply to emails or write reports. So during evenings and weekends I spend some time to catch up on the administration.
    IC: How often do you visit Guang Hua (the Taiwan Computer Market)?
    JH: I visit regularly, though more often for investigation. I was there last weekend checking to see how GIGABYTE was selling compared to other 8-series motherboard manufacturers. I would ask regarding specific models and how frequently GIGABYTE was chosen for new computers.
    IC: To what extent do you take your competitors’ products apart for analysis?
    JH: We take their products and pass them through every department, and they will make up their reports. We then have a general meeting with sales and we find the good and the bad from the competition and then we discuss whether to integrate the good features or discuss whether we have the same issues as them. We also do that non-motherboard products as well, such as tablets, smartphones, notebooks, NAS, etc. in order to get a feel or to see if there are any ideas already in the market.
    IC: How good or bad is the staff turnover in your division?
    JH: One thing we find is that even if someone leaves, eventually they return! People do move internally around the company – we get people from the PM move to sales or vice versa. We do not interview that regularly as the team is currently very stable. We currently have two guys from my team moving into sales, for example. In order to replace them we are interviewing both inside and outside the company, but for product management personnel in my team they have to know a little bit about every part of the design process and the company. Therefore it would be best to hire from within the company means a shorter training time rather than hiring from outside or hiring fresh out of college. It always depends on the person though and what direction the division has to take – if you hire fresh out of college then you attempt to build a long term team. If you have a job that needs to be done quickly then hiring with experience is more beneficial.
    IC: What influence do the media have on your position?
    JH: It is not so much influence, but we like to discuss what you think we do wrong and what you think we do right. It is all about feedback. It is always a back and forth sometimes discussing with media why we took some decisions over others but also on the feedback of those decisions.
    IC: How do you see the different departments in GIGABYTE progressing? Such as VGA, Server and Peripherals?
    JH: In terms of our VGA team they are doing quite well, gaining market share in the high-end and mainstream segments. On the server side, we know that they are not big in volumes, but they are very specialized in a lot of different products – for example the BRIXis from the Server team which is a specialized bit of kit. I am not too sure how the peripheral side is doing as they are not on the same floor in the HQ! But I know they are being more aggressive, and it is important to focus on lots of different product lines so that users have choice, and we encourage people to have more choice. For example many Chinese media say that tier-2 and tier-3 motherboard manufacturers are finding it quite hard because there is enough competition. We would like more manufacturers in the motherboard market for example in order to keep the market healthy.
    IC: And finally – what has been your best day working at GIGABYTE?
    JH: Haha! The recent one for me was when I was told by sales that our first production run of the Z87X-OC all sold out. As a result system integrators and our customers want to order more, so our estimations were too low and it bodes very well for the development of this type of product. It all comes down to HiCookie providing his experience and defining the product.
    IC: Many thanks for the opportunity to interview you Jackson!



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    #3216

    Anandtech: ASUS Reports Disappointing VivoTab RT Sales, Stops Making RT Tablets

    In a move that’s likely to surprise…well, just about no one, the Wall Street Journal reports that ASUS will cease making Windows RT tablets. Windows RT is basically stuck in limbo between full Windows 8 (and 8.1) laptops and hybrid devices on the high-end and Android tablets on the low-end, and the market appears to be giving a clear thumbs down to the platform. Many critics have also noted the lack of compelling applications to compete with Android and iOS platforms, which is something we noted in our review of the VivoTab RT last year.
    This morning, ASUS Chief Executive Jerry Shen stated, “It's not only our opinion, the industry sentiment is also that Windows RT has not been successful.” Citing weak sales and the need to take a write-down on its Windows RT tablets in the second quarter, ASUS will be focusing its energies on more productive devices. Specifically, Shen goes on to state that ASUS will only make Windows 8 devices using with Intel processors, thanks to the backwards compatibility that provides—and something Windows RT lacks.
    It looks like many feel towards Windows RT similar to how they feel towards Windows Phone 8. As Vivek put it in our recent Nokia Lumia 521 review, “Microsoft cannot expect to gain back market share after this many years unless they’re willing to aggressively ramp their development cycle the way Google did with Android a few years ago—something they have thus far shown no indications of doing. They just haven’t iterated quickly enough, and I can’t think of a single time when I picked up a Windows Phone and thought it was feature competitive with Android and iOS. It’s not even because I use Google services; there are just a number of things that are legitimately missing from the platform.”
    The situation with ASUS ditching Windows RT (at least for the near future) reminds me of what we saw with the netbook space several years ago. ASUS had some great initial success with the first Eee PC, and then just about every manufacturer came out with a similar netbook…and most of them failed. Couple that with a stagnating platform (Atom still isn’t much faster now than it was when it first appeared, though the next Silvermont version will likely address this), and most of the netbook manufacturers have moved on to greener pastures. Specifically, we’re talking about Android tablets, and while most companies didn’t stop making Android products to try out Windows RT devices, we will likely see fewer next-gen Windows RT devices and more next-gen Android tablets in the next year or two. With Haswell showing potential to compete head-to-head with tablets for battery life, more lucrative Haswell-based tablets running full copies of Windows 8.1 look far more promising than RT.



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    #3217

    Anandtech: Xeon E5-2600 V2 Price List: Server Ivy Bridge-EP

    We have known for a while that the Ivy Bridge-E launch will supposedly take place in a few weeks time, with information about pricing of the consumer components coming to light recently. Despite the high cost of entry for consumers, the business aspect of these processors along the Xeon brand is arguably the more poignant and certainly the more profitable aspect of the business. Recently CPU-World has put many of the pieces of the puzzle together, from a variety of leaks from partners, in terms of which processors are being released, their intimate details, and importantly, pricing.
    To follow on the naming scheme of Sandy Bridge -> Ivy Bridge -> Haswell Xeons, these processors, destined for 2P systems, will take on the E5 26xx naming scheme with V2 on the end, with L designating low power versions. We have the following list to browse and prepare servers for:
    Model Cores Frequency L3 cache TDP Pre-order price
    Xeon E5-2603 v2 4 1.8 GHz 10 MB 80 Watt $231.62
    Xeon E5-2609 v2 4 2.5 GHz 10 MB 80 Watt $337.03
    Xeon E5-2620 v2 6 2.1 GHz 15 MB 80 Watt $464.48
    Xeon E5-2630 v2 6 2.6 GHz 15 MB 80 Watt
    Xeon E5-2630L v2 6 2.4 GHz 15 MB $701.01
    Xeon E5-2637 v2 4 3.5 GHz 15 MB $1140.99
    Xeon E5-2640 v2 8 2 GHz 20 MB 95 Watt $1013.54
    Xeon E5-2643 v2 6 3.5 GHz 25 MB 130 Watt
    Xeon E5-2650 v2 8 2.6 GHz 20 MB 95 Watt $1335.85
    Xeon E5-2650L v2 10 1.7 GHz 25 MB 70 Watt $1395.91
    Xeon E5-2660 v2 10 2.2 GHz 25 MB 95 Watt $1590.78
    Xeon E5-2667 v2 8 3.3 GHz 25 MB 130 Watt $2320.64
    Xeon E5-2670 v2 10 2.5 GHz 25 MB 115 Watt
    Xeon E5-2680 v2 10 2.8 GHz 25 MB 115 Watt $1943.93
    Xeon E5-2687W v2 8 3.4 GHz 20 MB 150 Watt $2414.35
    Xeon E5-2690 v2 10 3 GHz 25 MB 130 Watt $2355.52
    Xeon E5-2695 v2 12 2.4 GHz 30 MB 115 Watt $2675.39
    Xeon E5-2697 v2 12 2.7 GHz 30 MB 130 Watt $2949.69
    Most of these cores will feature Hyperthreading, giving between 4 and 24 threads within an 80-150W envelope. These prices are currently listed as consumer based pre-order prices, and equate to ~12-30% more than the current Sandy Bridge-E offerings. We expect none of these parts to be overclockable via the multiplier, following Intel's previous Xeon launches.
    With any luck we should be getting a couple of Ivy Bridge-E based server motherboards in to test, along with Xeon processors. Interestingly enough, vague rumours of a 15 core chip have not evolved into anything concrete as of yet, at least not to be released at the same time as the others.
    Source: CPU-World



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    #3218

    Anandtech: Phanteks Enthoo Primo Case Review

    Work in this industry for long enough, and the word "innovation" will grate like glass in your eardrums. Every so often, though, a case comes along that merits it, and the Phanteks Enthoo Primo is one of them.


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    #3219

    Anandtech: MSI Z87 XPower Review: Our First Z87 with PLX8747

    When it comes to motherboard extravagance, X58 heralded some mightily expensive boards, and a choice few from X79 and Z77 also raised this baton. So where does a $440 Z87 motherboard sit in this genre? Today we tackle the MSI Z87 XPower.


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    #3220

    Anandtech: Acer S7-392 Haswell Ultrabooks Now Available

    Acer sent along word today that their S7 Ultrabook, now updated with Haswell internals, is available for order. At present, Acer lists two different models; as usual, the less expensive model includes a Core i5 processor and a 128GB SSD, and the high-end model upgrades the CPU to a Core i7 processor and includes a 256GB SSD. Thankfully, both come with 8GB memory and a 1920x1080 IPS touchscreen display. Anand previewed performance of the Acer S7 around the time of the Haswell launch, but it was prerelease hardware. We don’t expect performance to have changed much, but battery life should be better judging by what we’ve seen of other Haswell offerings. Here’s the full rundown of the specifications for the two models.
    Acer S7 Haswell Ultrabook Specifications
    Model S7-392-6832 (NX.MBKAA.008) S7-392-9890 (NX.MBKAA.009)
    Processor Intel Core i5-4200U
    (Dual-core 1.6-2.6GHz, 3MB L3, 22nm, 15W)
    Intel Core i7-4500U
    (Dual-core 1.8-3.0GHz, 4MB L3, 22nm, 15W)
    Chipset H87 (?)
    Memory 8GB (2x4GB onboard)
    Graphics Intel HD Graphics 4400
    (16 EUs at 200-1000MHz)
    Intel HD Graphics 4400
    (16 EUs at 200-1100MHz)
    Display 13.3" Glossy IPS 1080p (1920x1080)
    Storage 128GB (2x64GB RAID 0) SSD 256GB (2x128GB RAID 0) SSD
    Optical Drive N/A
    Networking 802.11n WiFi (Intel Advanced-N 7260)
    (Dual-band 2x2:2 300Mbps capable)
    Bluetooth 4.0 + HS (Intel)
    Audio Realtek HD
    Stereo Speakers
    Headset combo jack
    Battery/Power 4-cell, ~7.32V, 6280mAh, 46Wh
    65W Max AC Adapter
    Front Side N/A
    Left Side Power Button
    Headphone/Microphone jack
    Mini-HDMI
    AC Power Connection
    Right Side Memory Card Reader
    1 x USB 3.0
    1 x USB 3.0 (Powered when sleeping)
    Back Side N/A (Exhaust vent located on bottom)
    Operating System Windows 8 64-bit
    Dimensions 12.7" x 8.8" x 0.5" (WxDxH)
    (323mm x 224mm x 12.7mm)
    Weight 2.87 lbs (1.3kg)
    Extras HD Webcam
    67-Key Backlit Keyboard
    Flash reader (MMC /SD)
    Pricing MSRP: $1450
    Online: $1450
    MSRP: $1700
    Online: $1650
    In terms of the exterior design, as far as I can tell nothing has changed – for better or for worse – so most of what we said in our earlier Ivy Bridge S7 review still applies. That means you still get a funky keyboard that’s missing the top row of function keys, and there’s not a whole lot of key travel either. Still, it’s an extremely thin and attractive design overall, and just because the exterior didn’t change doesn’t mean that nothing else has improved.
    Besides the new Haswell processors, the new S7-392 series Ultrabooks come with 8GB of memory now, shoring up one of the weak spots. The wireless solution has also been updated to Intel’s Advanced-N 7260; it would have been great to get 802.11ac, so really the change from a Qualcomm/Atheros 2x2:2 dual-band solution to the new Intel equivalent isn’t likely to radically alter WiFi performance. Finally, the battery received an upgrade capacity as well, making the new S7 even more portable than before. In Anand’s testing, the new S7 delivered just over seven hours of useful battery life (compared to only four hours on the earlier model).
    Pricing remains roughly the same as before, unfortunately, so even though the new model is definitely better than previous model, we’re not sure how many people are willing to fork over $1400-$1700 for a new Ultrabook. If you count yourself among those who are interested in such a laptop, the new S7-392 models are available starting today at a variety of online vendors. We were able to find at least a couple places that are selling the upgraded model for less than the MSRP, and we think the added SSD capacity and performance is probably worth the extra $200. Get that price closer to $1500 and I’m sure more people would be willing to take a bite.



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