Thread: Anandtech News

EKWB has announced the release of several new EK-FC terminals for use with multi-GPU setups. The new design, EK says, is more minimalistic than the previous version, with the terminal itself having only an engraved EK logo on it. The legacy FC terminals weren't really full of flare and simply had the FC Terminal engraved on it along with the EK logo. In that respect, the changes are not easily noticeable. They are now compatible with the aesthetic terminal covers and have options for inlet/outlet points.
The X series FC terminals come in Acetal and Plexi versions allowing the user aesthetic options to fit their needs. The black terminals are made from high-quality POM Acetal material and CNC machined to shape. The Plexi version uses acrylic and is cast and machine-polished for a high-gloss glass-like finish. The new terminals have more connectivity options over the previous versions. The Z series offers two inlet ports on either side so the user can choose which side is inlet/outlet. Both serial and parallel terminals use standard G1/4” threads which sit flush with the body of the terminal. The terminal covers can also be removed if that is the preferred look. Each terminal includes the unit itself, two G1/4" plugs and a mounting mechanism as well as a spare terminal O-ring and spare screw. EK says all other parts are to be reused from the FC blocks.

The X Series terminals were redesigned in that all the ports are now flush with the terminal. This change eliminated the need for additional extender fittings. The new terminals are compatible with EK’s aesthetic terminal covers on the EK-FC series GPU water blocks. Outside of those changes, the X series terminals function the same as the old ones. Users are able to choose parallel or serial terminals for the X2 and X3 lines. The serial terminals are noted by an “S” on the label. The X# labeling indicates the number of GPU water blocks a terminal can connect. For example, the EK-FC Terminal X3 S connects three GPU water blocks and comes in a serial configuration.

There are serial and parallel X series terminals for dual, tri, quad, and seven GPUs. The X2/3 are available in Serial or Parallel including acetal or plexi. The X4 and X7 (for mining?) are only available in parallel and acetal configurations. Also worth noting are the gaps between PCIe slots correspond to a different terminal. The EX-FC Terminal X has three versions for different PCIe spacing. Default uses a 40.6mm / 1.6” gap. The EK-FC Terminal X2 1-slot version covers a single space PCIe configuration (20.3mm / 0.8”) gap while the 3-slot spans triple spaced slots (60.9mm / 2.4”). Verify compatibility through the EK website.

All 16 versions of the X Series FC Terminals are available now through the EK Webshop and Partner Reseller Network. Additional terminal models will become available in the coming weeks.

EKWB EK-FC Terminals
	Connection Type	MSRP (incl. VAT) / USD
EK-FC Terminal X2 - Plexi	Parallel	28.95€ / $32.99
EK-FC Terminal X2 - Acetal	Parallel	17.95€ / $20.99
EK-FC Terminal X2 S - Plexi	Serial	17.95€ / $32.99
EK-FC Terminal X2 S - Acetal	Serial	17.29€ / $20.99
EK-FC Terminal X2 1-slot - Plexi	Parallel	24.95€ / $29.99
EK-FC Terminal X2 1-slot - Acetal	Parallel	23.95€ / $25.99
EK-FC Terminal X2 3-slot - Plexi	Parallel	29.95€ / $32.99
EK-FC Terminal X2 3-slot - Acetal	Parallel	19.95€ / $22.99
EK-FC Terminal X3 - Plexi	Parallel	32.95€ / $35.99
EK-FC Terminal X3 - Acetal	Parallel	23.95€ / $27.99
EK-FC Terminal X3 S - Plexi	Serial	32.95€ / $35.99
EK-FC Terminal X3 S - Acetal	Serial	23.95€ / $27.99
EK-FC Terminal X3 (Type II) - Acetal	Parallel	27.95€ / $29.99
EK-FC Terminal X3 S (Type II) - Acetal	Serial	27.95€ / $29.99
EK-FC Terminal X4 -Acetal	Parallel	36.95€ / $39.99
EK-FC Terminal X7 - Acetatl	Parallel	49.95€ / $59.99

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This morning, Microsoft is live-streaming their Windows Developer Day, where they are showcasing some of the new APIs and features coming to the Windows 10 Fall Creators Update, due for distribution on October 17^th. If you’re an interested developer, and missed out on the live-stream. Microsoft will more than likely make it available in its entirety later as well.
Corporate VP, Kevin Gallo, as well as some of the engineering team, are discussing the significant update to Windows 10’s APIs and capabilities, with “thousands of new capabilities and improvements” available in the latest Software Development Kit (SDK).

Since this day is aimed at developers, as you’d expect, the features they are discussing are aimed at that target. There’s quite a few exciting features coming with the next update for Windows which developers are going to want to check out.

One of the coolest new features coming to Visual Studio 2017 version 15.4, is the Windows application packaging project. This sounds like a mouthful, and maybe not that exciting, but if you’re a developer, especially in the enterprise, this could be a fantastic way to repackage your applications to deploy much quicker and easier to your Windows 10 clients. The new packaging project allows you to quickly and easily repackage an application into a Windows 10 app, without having to convert the existing installer at all. You just add the project and that is it. If you recall Windows Centennial, which is a bridge to move Win32 apps into the Windows Store, this is a similar idea, but packaged directly into Visual Studio, and possibly an even simpler process. Once the app is converted, all of the APIs available for UWP apps are available, including things like Windows Hello, for authentication. The app will also gain the deployment capabilities of Windows 10, which have been improved for the Fall Creators Update as well, which include the ability to only download the delta of an update for smaller deployments, and extending the ability to break up the install into components for quicker installs of just the components a person requires. Windows 7 is still the dominant platform in the enterprise, but Windows 10 is making inroads here, and capabilities such as this should help drive deployment.

Developers will also gain access to the Microsoft Graph APIs and Project Rome. The former allows apps to have access to data across Office 365. It’s part of the new push to smarter, data driven analytics, and allows an app to access resources connected by relationships. With the breadth of data inside of graph, apps can do things like automatically schedule meetings, even of people not in the same organisation, or let workers know which meetings they can likely skip, allowing them to be more productive with their work time. Project Rome, on the other hand, is a way to have users have a continuance of experience across different device types, and it’s available on Windows, Android, and iOS, as well as in Xamarin.

Game developers who are building UWP games also gain access to more of a computer’s resources. Traditional Win32 games could, and often do, take over as much of the computer as they need, but UWP games, which are generally less demanding, When Windows 10 launched, UWP games could only access 4 shared cores, 1 GB of RAM, and 50% of a DX11 GPU. With the Fall Creators Update, UWP games can now access 6 exclusive cores, 5 GB of RAM, and full DX12 GPU access. This should allow UWP games to compete with the Win32 games in almost all aspects, and is a big step up.
This change also allows UWP games to be made available for the Xbox console, and with the Xbox Live Creators Program, game developers will now be able to publish directly to both Windows 10 and Xbox One, with a much simpler certification process than before. This is a big change from when Xbox first launched, and should open up some more independent games to the platform.
There is more, of course, being discussed, such as the new Fluent Design, which we’ve covered a few times in the past, but for a quick refresher, is a new design language for Windows 10 which is based on light, depth, motion, material, and scale, and is the first major redesign of the OS since it launched. Some apps built into Windows have already had the Fluent Design makeover, and the new look and feel is quite nice to see, and even more importantly, can make an app easier to use as well.

Mixed Reality is also a big topic, and Microsoft has really embraced this as the next wave of computing. From VR to AR to everything in between, Mixed Reality has the capability to change the way we use computers. So far, the VR movement has been a bit slower than I would have anticipated though, and while AR is certainly interesting, Microsoft’s big play here is Hololens, which is still mostly a development tool at the moment.
Windows 10 Fall Creators Update will be out on the 17^th of this month, and we will take a closer look at the changes soon.
Source: Microsoft

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Today, less than 2 weeks since 17.9.3, AMD has released Radeon Software Crimson ReLive Edition 17.10.1, bringing support for Middle-earth: Shadow of War (launching today) and The Evil Within 2 (launching this Friday). 17.10.1 is also adding Radeon Chill profiles for both games.
As a relatively minor update, 17.10.1 includes only two documented bug fixes. The first bug fix resolves issues where bezel compensation in mixed mode Eyefinity could not be applied. The second addresses flickering of tire graphics in DiRT 4 during gameplay or particular terrain conditions under multi-GPU configurations.

Among the known issues, the two new ones concern crashing during Radeon Software upgrading on Windows 7 mGPU Vega configurations, and corrupted graphics on certain HDR displays in Forza Motorsport 7 when HDR is enabled in-game. The workaround for the former is a clean install of Radeon Software.
While on the topic of Forza Motorsport 7, this past week has seen both AMD and NVIDIA square off with claims of significant in-game performance; for 17.9.3, AMD cites RX Vega⁵⁶ achieving up to 90FPS at 4K as one of several examples, while NVIDIA more generally cites performance improvements of 15 – 25% from 387.92.

The updated drivers for AMD’s desktop, mobile, and integrated GPUs are available through the Radeon Settings tab or online at the AMD driver download page. More information on this update and further issues can be found in the Radeon Software Crimson ReLive Edition 17.10.1 release notes.

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The Toshiba TR200 finally brings Toshiba's 3D NAND to the retail SSD market. Where Western Digital and SanDisk chose to go after Samsung's performance with their 64L 3D NAND SSDs, Toshiba's TR200 is an entry-level DRAMless SATA SSD that will have to compete solely on price. The TR200 does not bring any performance improvement over the TR150 it replaces, but it may bring respite from the past year's price increases.

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Clevo, a large OEM/ODM exclusively producing laptop computers, has announced three new laptops powered by the recently released Coffee Lake-S (desktop) CPUs. The flagship P870TM supports up to a 95W CPU in the hex-core i7-8700K and either a GTX 1070 or GTX 1080 as a single card or in SLI. The two other models, the P775TM, and P751TM, share the same options for processors, but for the most part different with GPU options. The P775TM gives users the choice of a GTX 1060, GTX 1070, or GTX 1080 in while the P751TM offers a GTX 1060 or GTX 1070 both in single card configurations.
The flagship P870TM replaces last year’s model, the P870KM, which was a pretty powerful desktop replacement laptop. The big change is going to be in CPU department with the incoming 8^th generation Coffee Lake-S CPUs replacing the 7^th generation Kaby Lake processors as options. Clevo posted benchmarks of Cinebench R15 claiming a 45.7% improvement over the i7-7700K on the last generation laptops; a direct result of the 50% increase in cores and threads in the i7-8700K. Video card options remain the same with a single or SLI GTX 1070 or GTX 1080s with support for 4K/FHD 17.3 displays using NVIDIA G-SYNC. Both the CPU and the GPU(s) are overclockable through the BIOS. Powering the laptop will be a 330W-660W power supply (based on GPU configuration).

Memory capacity is up to 64GB with speeds up to 3000MHz using its four DIMM slots. The network side is handled by an integrated Killer GbE ethernet and Killer Wifi capabilities. Another feature is the use of the Killer Double Shot Pro used allowing the use of both the wired and wireless networks at the same time for more useable bandwidth. Audio processing is tuned by Creative Sound Blaster X Pro-Gaming 360 and includes an ESS high-resolution headphone audio. Another feature focused on gaming is the fully backlit RGB LED keyboard supporting 44-key rollover and anti-ghosting. Overall a beefy set of specifications.

The P775TM and P751TM series offer similar specifications to the P870TM including the choice of processors but mainly differ with the available GPU options. To that end, the P775TM gives users a choice of a GTX 1060, GTX 1070, or a GTX in single GPU form. The P751TM gives users a choice of a GTx 1060 or a GTX 1070, only in single card configurations. The P775TM has an improved audio setup with a built-in subwoofer-speaker combination, with the P775TM and P751TM also tuned by Creative’s Sound Blaster X Pro-Gaming 360 as their big brother is.

Though Clevo will sell these outright, we can expect to see their resellers (Sager, Eurocom, Origin PC, Falcon Northwest, and dozens more) releasing their implementations in the coming weeks as well. Pricing was not listed and will vary depending on the hardware configuration selected.
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Gallery: Clevo P870TM, P755TM and P751TM Gallery

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EKWB is adding two new slim radiators to their portfolio, the EK-Coolstream SE 140 and EK Coolstream SE 280. With case manufactures expanding their fan form factors to include 140mm fans, these two radiators EKWB says, “…will fill the gap in our radiator lineup where high-performance and high-compatibility slim radiators are needed.” One of the key features on the new EK-Coolstream radiators is the measurements. Many radiators tend to be larger than the fans meant for it, but these two measure exactly 140mm wide and 28mm thick which should allow it to fit in places some others radiators cannot.
Both products have a black matte finish on the aluminum/steel housing with the product name in white on the top as well as the EW symbol by the ports. Inside the radiator are brass chambers ensuring it is not a mixed metal environment. The fins are made out of copper. The parallel flow cooling chambers are said to hydraulic flow resistance, while the 22 FPI density in both models whisks the heat away. The two port threads are the standard G1/4”.

The overall dimensions measure (L)180 x (W)140 x (H)28mm (7.1” x 5.5” x 1.1”) weighing in at 0.9kg (1.98 lbs). Any standard size fan, 140 x 140 x 25mm, is compatible with either radiator and are not included. The shrouds are tapped using UNC 6-32 threads on both sides allowing for a push or pull, or a push and pull configuration. Included are two pre-installed G1/4” extenders, flat-head 6-32 screws (30mm and 5mm) as well as a 2.5mm Allen key.

Both the EK-CoolStream SE 140 and SE 280 are available for purchase through EK Webshop and their Partner Reseller Network.

EKWB EK-CoolStream SE 140 and CoolStream SE 280
	MSRP (incl. VAT) / USD
EK-CoolStream SE 140	49.95€ / $49.99
EK-CoolStream SE 280	69.95€ / $69.95

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Gallery: EKWB CoolStream SE 140/180 Gallery

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An HP executive said be quoted on record at an industry event stating that the company has axed development of future devices based on Microsoft’s Windows 10 Mobile operating system, and that the Elite X3 will be the final smartphone featuring the OS. HP indicated that Microsoft has shifted its priorities when it comes to mobile platforms and HP no longer sees Windows 10 Mobile as a competitive offering for its clients. Meanwhile, sales of the HP Elite X3 will continue until 2019.
HP was the first to support Microsoft’s Windows CE 2.0 platform in the mid-1990s and has continued to support Microsoft’s mobile operating systems since then, offering devices based on Windows for Pocket PC, Windows Mobile, Windows Phone and others. HP was among a few companies to sell smartphones based on the Windows 10 Mobile with its Elite X3, but it looks like the company does not have plans for any future devices based on Microsoft’s OS for smartphones.
Microsoft’s Windows Mobile was among the most popular operating systems for smartphones in the U.S., but after Apple launched iOS and Google released Android, the popularity of WinMo quickly dropped. Eventually, after Satya Nadella took over as CEO of Microsoft, the company began to focus on development of software for other platforms and cloud services.
HP implies that Microsoft does not invest in its own mobile OS enough to make it competitive, which is why HP is no longer interested in developing devices featuring the platform. The company will keep selling the Elite X3 until 2019, so for at least 14 more months.
"Microsoft, as all companies do, decided on a change in strategy and so they are less focused on what they thought they would be focused on today," said Nick Lazaridis, the head of HP EMEA, in an interview with The Register. "Given that, we also had decided that without Microsoft's drive and support there it doesn't make sense. If the software, if the operating system ecosystem isn't there then we are not an operating system company."

Microsoft denies that it has ceased development of its Windows 10 Mobile platform and says that it intends to continue to development of the OS and supporting its existing Lumia smartphones. Meanwhile, the company does not announce plans for future version of the operating system and future devices.
At present, the HP Elite X3 is available directly from HP, from Microsoft Store and from Amazon, so we cannot say that the device has been discontinued.
Buy HP Elite X3 on Amazon.com
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Today, Facebook owned Oculus announced their follow up to the Oculus Rift VR headset, and they’ve decided to make the entry point to Oculus VR much easier to access. At $199, the new Oculus Go is significantly undercutting the $599 launch price of the Rift, which has seen its own price cut to $399 since it launched about a year and a half ago. But the Go is not just a less expensive version of the Rift. It’s a self-contained VR system, providing untethered VR capabilities.
Despite the lower price, the Go has a higher resolution display than the Rift. The Go features a 2560x1440 “Fast-switch” LCD display, which is a bump up from the 2160x1200 combined resolution of the two OLED displays in the Rift. Fast-Switch likely means a higher refresh rate, but no specifications have been announced yet to see how it compared to the 90 Hz of the Rift. Oculus is also promoting the optical lenses are new and improved for the Go, offering a wider field of view and less glare. The LCD display and new lenses should help with the screen door effect that is present on VR headsets, but we’re still a long way from having the processing power to remove this completely.

Oculus Go also includes integrated spatial audio, which is one of the big features Oculus promoted on the Rift when it launched. The speakers are built-in to the sides of the headset, so no extra equipment is necessary. They have had the courage though to add a 3.5mm headphone jack, if you want to listen privately.
Go and Gear are "binary compatible" so any apps that work on Gear, should work on Go. It's helpful to have an ecosystem when you're launching a new product.
The new headset is made of a new breathable cloth, for improved comfort, and the Go can be used with glasses.

Unlike the Rift, the untethered nature of the Go means that it won’t have the full tracking capabilities, but that can be a benefit as well since not everyone has a dedicated location they can leverage VR. At the outset, the Go seems like a well priced, capable VR headset, and although it won’t have the gaming potential of a full PC behind it, the capabilities of a smartphone SoC have been improving dramatically over the years. Unfortunately Facebook / Oculus hasn’t announced what is actually powering the Go, so we’ll have to wait and see how much performance they can get for $199. Tomshardware is reporting it's a Snapdragon 821.
The Oculus Go ships early next year.
Source: Oculus Blog
Gallery: Oculus Announces Oculus Go: Untethered VR For $199 USD

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Qualcomm’s global legal issues continue, as the Taiwanese Fair Trade Commission (TFTC) fined the company roughly $773 million (NT$23.4 billion) for illegal licensing and chip pricing practices. This development is yet another antitrust filing levied onto Qualcomm, which has recently seen fines from South Korea (December 2016) and China (February 2015), a lawsuit from the US Federal Trade Commission (January 2017), and investigation and potential non-compliance fines from the European Union.
The official TFTC statement states that Qualcomm withheld products and licensing in order to force clients to agree to its conditions, noting Qualcomm’s numerous standard-essential patents (SEP) and monopoly status in the baseband processor market for the CDMA, WCDMA, and LTE spaces. The TFTC found that these actions and others violated antitrust laws for at least seven years, during which Taiwanese companies paid Qualcomm around NT$400 billion (~$13.2 billion) in licensing fees and $30 billion in baseband processors purchases. Essentially, these findings match the US FTC’s charges of Qualcomm’s “no license, no chips” policy and their refusal to license standard-essential patents.
In addition to the fine, the TFTC is demanding Qualcomm cancel agreements and clauses where competitors were forced to disclose sensitive company data, including prices, product model names, shipments, sales targets/volumes, and customer names.
In the meantime, Qualcomm remains enmeshed in a series of interconnected lawsuits with Apple, with the most recent development occurring just a few months ago.
In response to the TFTC ruling, Qualcomm released their own statement disagreeing with findings and stating plans to appeal the decision. Since appealing against South Korean regulators, this marks the second time Qualcomm is appealing such antitrust fines.

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Western Digital sprang a big surprise yesterday with the announcement of microwave-assisted magnetic recording (MAMR) as the foundation for the next generation of high-capacity hard drives. Hard drives may be on the way out for client computing systems, but they are still the storage media of choice for data centers. As recently as last year, heat-assisted magnetic recording (HAMR) was expected to be the next major technology update in the hard drive industry, but this potentially falls by the wayside for MAMR. This article presents a detailed analysis of Western Digital's MAMR announcement.


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