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Thread: Intel News

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    #1261

    Intel: Chip Shot: Intel Experience Stores to Open for Holiday Season

    For the first time ever, Intel will open pop-up stores for the holiday season. Intel Experience Stores will be located in Nolita, NYC (opening Nov. 23), Lincoln Park, Chicago (opening Nov. 25), and Venice, CA (opening Nov. 26). Visitors will have the unique opportunity to experience some of the latest Intel-based devices on the market today, including laptops, tablets, 2 in 1 devices and portable all-in-one PCs, while also having access to Intel tech experts who can help with purchasing decisions or just simply provide technology advice. Intel will allow people to test drive certain Intel-based devices at home, and Intel-based devices on display will be available to buy online from inside the Intel Experience Stores. For more information, visit www.intel.com/stores.




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    #1262

    Intel: Chip Shot: Intel® Media SDK for Servers Now Supports Linux and Windows

    Intel today announced that Intel® Media SDK 2013 for Servers now supports both Linux and Windows server operating systems. The SDK helps enable servers to deliver up to 12x the amount of simultaneous HD video streams over traditional software-only solutions. The SDK supports servers from major manufacturers running 4th generation Intel® Core™ processors and the Intel® Xeon® processor E3-1200 v3 product family (formerly codenamed "Haswell") with Intel® IrisT Pro and Intel® HD Graphics. It helps reduce total cost of ownership while enabling high-quality hardware acceleration for video. The SDK also offers better server density and improved energy efficiency for real-time streaming, teleconferencing and video analytics. More information about developer licenses are available at intel.com.




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    #1263

    Intel: Chip Shot: How to Streamline Holiday Travel with Mobile Hosted by Intel Mobile

    Holiday travel planning can be stressful, costly and a painful chore. With an array of new travel apps available to help streamline the planning and booking process, mobile devices can be one of the best travel gadgets you own. In this month’s episode of 'Mobile Insights Radio with Peter Biddle,' ReeD Martin, director of Design & User Experience at Mobiata/Expedia discusses how mobile has put the human experience back into travel, with apps streamlining everything from travel planning, to booking, to travel management flow. Mobile Insights Radio, hosted by Peter Biddle, Intel engineer and executive, is an online radio program that brings together a variety of perspectives to discuss the fusion of technology, life, culture and science.




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    #1264

    Intel: Intel Brings Supercomputing Horsepower to Big Data Analytics

    NEWS HIGHLIGHTS.

    • Intel discloses form factors and memory configuration details of the CPU version of the next generation Intel® Xeon Phi™ processor (code named "Knights Landing"), to ease programmability for developers while improving performance.
    • Intel® Xeon® processor-based systems power more than 82 percent of all supercomputers on the recently announced 42nd edition of the Top500 list.
    • New Intel® HPC Distribution for Apache Hadoop* and Intel® Cloud Edition for Lustre* software tools bring the benefits of Big Data analytics and HPC together.
    • Collaboration with HPC community designed to deliver customized products to meet the diverse needs of customers.





    SUPERCOMPUTING CONFERENCE, Denver, Nov. 19, 2013 –Intel Corporation unveiled innovations in HPC and announced new software tools that will help propel businesses and researchers to generate greater insights from their data and solve their most vital business and scientific challenges.

    "In the last decade, the high-performance computing community has created a vision of a parallel universe where the most vexing problems of society, industry, government and research are solved through modernized applications," said Raj Hazra, Intel vice president and general manager of the Technical Computing Group. "Intel technology has helped HPC evolve from a technology reserved for an elite few to an essential and broadly available tool for discovery. The solutions we enable for ecosystem partners for the second half of this decade will drive the next level of insight from HPC. Innovations will include scale through standards, performance through application modernization, efficiency through integration and innovation through customized solutions."

    Accelerating Adoption and Innovation
    From Intel® Parallel Computing Centers to Intel® Xeon Phi™ coprocessor developer kits, Intel provides a range of technologies and expertise to foster innovation and adoption in the HPC ecosystem. The company is collaborating with partners to take full advantage of technologies available today, as well as create the next generation of highly integrated solutions that are easier to program for and are more energy-efficient. As a part of this collaboration Intel also plans to deliver customized HPC products to meet the diverse needs of customers. This initiative is aimed to extend Intel's continued value of standards-based scalable platforms to include optimizations that will accelerate the next wave of scientific, industrial, and academic breakthroughs.

    During the Supercomputing Conference (SC'13), Intel unveiled how the next generation Intel Xeon Phi product (codenamed "Knights Landing"), available as a host processor, will fit into standard rack architectures and run applications entirely natively instead of requiring data to be offloaded to the coprocessor. This will significantly reduce programming complexity and eliminate "offloading" of the data, thus improving performance and decreasing latencies caused by memory, PCIe and networking.

    Knights Landing will also offer developers three memory options to optimize performance.Unlike other Exascale concepts requiring programmers to develop code specific to one machine, new Intel Xeon Phi processors will provide the simplicity and elegance of standard memory programming models.

    In addition, Intel and Fujitsu recently announced an initiative that could potentially replace a computer's electrical wiring with fiber optic links to carry Ethernet or PCI Express traffic over an Intel® Silicon Photonics link. This enables Intel Xeon Phi coprocessors to be installed in an expansion box, separated from host Intel Xeon processors, but function as if they were still located on the motherboard. This allows for much higher density of installed coprocessors and scaling the computer capacity without affecting host server operations.

    Several companies are already adopting Intel's technology. For example, Fovia Medical*, a world leader in volume rendering technology, created high-definition, 3D models to help medical professionals better visualize a patient's body without invasive surgery. A demonstration from the University of Oklahoma's Center for Analysis and Prediction of Storms (CAPS) showed a 2D simulation of an F4 tornado, and addressed how a forecaster will be able to experience an immersive 3D simulation and "walk around a storm" to better pinpoint its path. Both applications use Intel® Xeon® technology.

    High Performance Computing for Data-Driven Discovery
    Data intensive applications including weather forecasting and seismic analysis have been part of the HPC industry from its earliest days, and the performance of today's systems and parallel software tools have made it possible to create larger and more complex simulations. However, with unstructured data accounting for 80 percent of all data, and growing 15 times faster than other data1, the industry is looking to tap into all of this information to uncover valuable insight.

    Intel is addressing this need with the announcement of the Intel® HPC Distribution for Apache Hadoop* software (Intel® HPC Distribution) that combines the Intel® Distribution for Apache Hadoop software with Intel® Enterprise Edition of Lustre* software to deliver an enterprise-grade solution for storing and processing large data sets. This powerful combination allows users to run their MapReduce applications, without change, directly on shared, fast Lustre-powered storage, making it fast, scalable and easy to manage.

    The Intel® Cloud Edition for Lustre* software is a scalable, parallel file system that is available through the Amazon Web Services Marketplace* and allows users to pay-as-you go to maximize storage performance and cost effectiveness. The software is ideally suited for dynamic applications, including rapid simulation and prototyping. In the case of urgent or unplanned work that exceeds a user's on-premise compute or storage performance, the software can be used for cloud bursting HPC workloads to quickly provision the infrastructure needed before moving the work into the cloud.

    With numerous vendors announcing pre-configured and validated hardware and software solutions featuring the Intel Enterprise Edition for Lustre, at SC'13, Intel and its ecosystem partners are bringing turnkey solutions to market to make big data processing and storage more broadly available, cost effective and easier to deploy. Partners announcing these appliances include Advanced HPC*, Aeon Computing*, ATIPA*, Boston Ltd.*, Colfax International*, E4 Computer Engineering*, NOVATTE* and System Fabric Works*.

    Intel Tops Supercomputing Top 500 List
    Intel's HPC technologies are once again featured throughout the 42nd edition of the Top500 list, demonstrating how the company's parallel architecture continues to be the standard building block for the world's most powerful supercomputers. Intel-based systems account for more than 82 percent of all supercomputers on the list and 92 percent of all new additions. Within a year after the introduction of Intel's first Many Core Architecture product, Intel Xeon Phi coprocessor-based systems already make up 18 percent of the aggregated performance of all Top500 supercomputers. The complete Top500 list is available at www.top500.org.


    About Intel
    Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

    Intel, Xeon, Xeon Phi and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

    * Other names and brands may be claimed as the property of others.

    1 From IDC Digital Universe 2020 (2013)

    Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

    Optimization Notice
    Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

    Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.




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    #1265

    Intel: Chip Shot: New for Holiday Wish List - Acer Chromebook C720, Only $199

    Newly available on Amazon and Best Buy, the new Intel-based Acer Chromebook C720-2848 goes for only $199, a great holiday gift option for budget minded consumers. The Acer C720-2848 runs on an Intel processor based on the Haswell micro-architecture delivering fast performance and up to 8.5 hours of battery life. Weighing in at only 2.76 lbs and measuring only .75-inches, the Acer C720-2848 is an affordable option for families and students who want an effective way to be productive, share Google Docs with study groups, access apps for school, pay bills and stay in touch via social networks.




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    #1266

    Intel: Chip Shot: Game Changer! Intel® Atom™ Processor-based SoC for Tablets Wins La

    Laptop Magazine named the new 64-bit Intel® Atom™ Processor Z3000 Series SoC (code named Bay Trail) its 2013 Game Changer Award Winner. As the publication wrote, “Made with the same 22-nanometer manufacturing process as Intel’s 4th generation Core series, Bay Trail processors offer plenty of power for real productivity, media playback and casual gaming. Yet because of their low-power design — and Intel’s aggressive pricing — quad-core Bay Trail CPUs appear in a new-generation of budget-minded Windows tablets.” Several tablets based on this award winning design are available this holiday season. Check them out here.




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    #1267

    Intel: Chip Shot: Intel Reveals More Details of Its Next Generation Intel® Xeon Phi™

    Today at the Supercomputing Conference in Denver, Intel discussed form factors and memory configuration details of the next generation Intel® Xeon Phi™ processor (code named "Knights Landing"). The new revolutionary design will be based on the leading edge 14nm manufacturing technology and will be available as a host CPU with high-bandwidth memory on a processor package. This first-of-a-kind, highly integrated, many-core CPU will be more easily programmable for developers and improve performance by removing "off-loading" to PCIe devices, and increase cost effectiveness by reducing the number of components compared to current solutions. The company has also announced collaboration with the HPC community designed to deliver customized products to meet the diverse needs of customers, and introduced new Intel® HPC Distribution for Apache Hadoop* and Intel® Cloud Edition for Lustre* software tools to bring the benefits of Big Data analytics and HPC together. View the tech briefing.




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    #1268

    Intel: Chip Shot: Intel and Jaguar Land Rover Collaborate on Future In-Vehicle Techno

    Intel and Jaguar Land Rover announced today they are collaborating to enhance the automaker’s research and product development on future in-vehicle technologies that deliver new driving experiences. The companies have already begun work across engineering and research, and programs are underway to develop next-generation digital vehicle prototypes that connect the car, mobile devices and the cloud. The insights gained from the research programs, along with alignment on engineering efforts, will help speed development on new in-vehicle technologies. Jaguar Land Rover also unveiled plans to open a new technology research and development center in Portland, Oregon which will further the collaborative research relationship with Intel Labs. Get more information here.




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    #1269

    Intel: Chip Shot: Intel CEO at Intel's Annual Investor Meeting

    Pictured: Intel CEO Brian Krzanich, tells investors at Intel’s annual investor meeting on Nov. 21, “if it computes, it does it best with Intel.” The meeting was held at Intel’s headquarters in Santa Clara, Calif.



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    #1270

    Intel: Chip Shot: Intel Receives U.S. Green Building Council Leadership Award

    Today Intel received the inaugural Ray Anderson Radical Industrialism Award from the U.S. Green Building Council (USGBC) during the Greenbuild International Conference and Expo. The recognition is part of the USGBC’s 2013 Leadership Awards, which celebrate the individuals and groups committed to green building design and construction. As of 2013, Intel has achieved Leadership in Energy and Environmental Design certification for 29 new and existing buildings around the world. For more, click here.




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