Thread: Anandtech News

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    #11491

    Anandtech: The SilentiumPC Fera 5 CPU Cooler Review: Quiet Cooling on a Budget

    In today’s review, we are taking a look at the Fera 5 tower CPU cooler from SilentiumPC.
    SilentiumPC's main focus is to design and produce products with a very good price-to-performance ratio – which is to say, budget products for the mainstream market. The Fera 5 CPU cooler, in turn, embodies those ideals, with a focus on effective and quiet cooling from a cooler that sells for around €30. And while a budget cooler isn't going to chart new territory in the CPU cooling space, as we'll see, SilentiumPC has been able to strike a solid balance between performance and price, delivering a tower cooler that is notably quieter than typical budget coolers.

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    #11492

    Anandtech: SK Hynix Releases Platinum P41 SSD: Going Even Faster With PCIe 4 and 176L

    First introduced back at CES 2022, this morning SK Hynix is finally kicking off sales of their new retail consumer SSD, the Platinum P41. The successor to the popular Gold P31, the P41 incorporates the latest controller and NAND technology from SK Hynix, upgrading their flagship SSD lineup with PCIe 4.0 connectivity and the performance to match. Though with prices topping out at $260 for the 2TB model, it would seem that SK Hynix has even greater ambition than before, placing the P41 squarely in the high-end segment of the SSD market.


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    Anandtech: Qualcomm Announces Snapdragon 8+ Gen 1: Moving to TSMC for More Speed, Low

    As the dark of the night rolls into China this evening, Qualcomm is hosting a mobile-focused product launch event they’re calling “Snapdragon Night”. Headlining the event is the announcement of the company’s new flagship SoC, the Snapdragon 8+ Gen 1. A mid-generation update to their flagship smartphone SoC, the Snapdragon 8 Gen 1, the 8+ Gen 1 follows Qualcomm’s annual tradition of releasing a refresh product to boost performance and to give partners something new to work with for the second half of the year. And for this year in particular, we’re looking at a very notable change in chips from Qualcomm.
    Unlike previous generations where Qualcomm merely launched a faster speed bin of their existing silicon, for 2022 we have something more substantial to talk about. Qualcomm has switched up foundries entirely – moving from Samsung to TSMC – and as a result is rolling out a new die. Thanks to this, the Snapdragon 8+ Gen 1 Qualcomm is reaping something of a one-off manufacturing gain, allowing them to both dial up CPU and GPU performance while simultaneously cutting power consumption.

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    Anandtech: Qualcomm Announces Snapdragon 7 Gen 1: Bringing Armv9 To Premium Smartphon

    Alongside the new Snapdragon 8+ Gen 1, as part of Qualcomm’s “Snapdragon Night” event in China this evening, the company is also rolling out a brand-new SoC for the premium phone market, the Snapdragon 7 Gen 1. Aimed downmarket of Qualcomm’s traditional flagship SoCs, the Snapdragon 7 Gen 1 is the first non-flagship SoC to be introduced by Qualcomm since they implemented their new platform naming and differentiation scheme. But, like the Snapdragon 7xx series before it, the latest Snapdragon 7 SoC follows the same design mantra of offering flagship-level features with more modest performance and costs.


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    #11495

    Anandtech: AMD Announces Mendocino APU: 6nm Mainstream Mobile Zen 2 Laptop Chip Comin

    Alongside their big desktop update for later in the year, AMD is also using this year’s Computex to announce an update to the low-end segment of their mobile lineup. In the fourth quarter of this year the company will be rolling out a new chip codenamed “Mendocino”, which is aimed at mainstream, high-volume Windows and ChromeOS notebooks. With 4 Zen 2 cores and RDNA 2 graphics, the relatively petite chip is intended to go into notebooks in the $399 to $699 range.
    Based on its intended market segment, AMD Mendocino (no relation to Intel’s) is positioned to end up as the successor to a mix of lower-end AMD SoC products, including the bottom of the Ryzen mobile stack (e.g. Ryzen 5300U) as well as AMD’s Ryzen C-class chips. Mainstream laptops are a huge part of the market in volume, and for both good reasons and bad, it’s always been an area where AMD has done well for itself. And while the current chip shortage hasn’t been fully resolved, AMD is finally in a position to update the lower-end of its APU lineup with some newer hardware built on a more recent manufacturing process, replacing their current hodgepodge of mostly Picasso (4C 12nm Zen+) based SKUs.


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    #11496

    Anandtech: AMD Ryzen 7000 Announced: 16 Cores of Zen 4, Plus PCIe 5 and DDR5 for Sock

    During the AMD Keynote at Computex 2022, its CEO, Dr. Lisa Su officially unveiled their next generation of Ryzen processors and the successor to the highly successful Ryzen 5000 series. The new family, the Ryzen 7000 series, will feature up to 16 Zen 4 cores using TSMC's optimized 5 nm manufacturing process.
    AMD Ryzen 7000 also officially marks the end of its long-serving AM4 socket, with the new AM5 LGA1718 socket replacing it with a freshly announced trio of new performance-driven chipsets, including X670E, X670, and B650.


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    #11497

    Anandtech: NVIDIA To Release Liquid Cooled A100 and H100 PCIe Accelerators

    Among NVIDIA’s slate of announcements tonight at Computex 2022, the company has revealed that it is preparing to launch liquid cooled versions of their high-end PCIe accelerator cards. Being offered as an alterative to the traditional dual-slot air cooled cards, the liquid cooled cards come in a more compact single-slot form factor for both improved cooling and improved density. The liquid cooled A100 will be available in Q3, and a liquid cooled H100 will be available early next year.
    While liquid cooling is far from new in the datacenter, it’s typically been reserved for more bespoke hardware with extreme cooling and/or density requirements, such as the upcoming generation of high-end NVIDIA H100 (SMX) servers. PCIe servers, by contrast, are all about standardization and compatibility. Which for server video cards/accelerators means dual slot cards designed for use with forced air cooling within a server chassis. This serves the market segment well, but the 300 to 350 Watt TDPs of these cards means that they can’t get any thinner and still be effectively cooled by air – which in turn creates a 4 card limit for standard rackmount systems.
    But times are changing, and liquid cooling is being implemented in datacenters in greater capacities both to keep up with cooling ever-hotter hardware, and to improve overall datacenter energy efficiency. To that end, NVIDIA will be releasing liquid cooled versions of their A100 and H100 PCIe cards in order to give datacenter customers an easy and officially supported path to installing liquid cooled PCIe accelerators within their facilities.
    The cards (pictured above) are essentially a reference A100/H100 with the traditional dual-slot heatsink replaced with a single-slot full coverage water block. Designed to be integrated by server vendors, they use an open loop design that is meant to be used as part of a larger liquid cooling setup.
    But other than changing the cooling system, the specifications of the cards remain unchanged. NVIDIA isn’t increasing the TDPs or clockspeeds on these cards, so their performance should be identical to traditional air cooled cards (so long as they’re not thermally throttling, of course). Put another way, these new cards are using liquid cooling to improve energy efficiency and density, rather than performance.
    The first card out of the gate will be the liquid cooled version of the 80GB A100 PCIe accelerator. That will be available to customers in Q3 of this year. Meanwhile a liquid cooled version of the H100 PCIe is also under development, and NVIDIA expects that to be available in early 2023.
    In the interim, NVIDIA has been working with Equinix in order to qualify the liquid cooled A100 within their datacenters, as well as to get an idea of the real-world power savings of the new hardware. Interestingly, NVIDIA is reporting a significant reduction in overall datacenter power usage from switching to liquid cooling – a 2000 server (4000 A100 card) setup saw its total power needs drop by 28%. According to NVIDIA, this is from a combination of overall power savings across the datacenter from the switch, including everything from improved video card energy efficiency from lower temperatures, to reduced energy needs from cooling water versus running large air chillers. All of which underscores why NVIDIA is promoting liquid cooled hardware as a power efficiency gain for datacenter operators who are looking to trim power usage.
    And while this first generation of liquid cooled hardware is focused on efficiency, according to NVIDIA that won’t always be the case. For future generations of cards the company will also be looking at liquid cooling to improve performance at current energy levels – presumably by investing the datacenter-scale gains back into higher TDPs for the cards.
    Finally, while the bulk of NVIDIA’s announcement today (as well as the case study) is focused on PCIe cards, NVIDIA is also revealing that they’ve been working on official, liquid cooled designs for their HGX systems as well, which are used to house the company’s more powerful SMX cards. A liquid cooled HGX A100 is already shipping, and a liquid cooled HGX H100 is slated to be released in Q4.


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    #11498

    Anandtech: Computex 2022: NVIDIA Keynote Live Blog (11pm ET/03:00 UTC)

    Kicking off day two of our Computex coverage is NVIDIA, who will be delivering an hour-long keynote for the show.
    The untitled keynote is slated to run for an hour and features a who's who of NVIDIA VPs, including Ian Buck (VP Accelerated Computing), Michael Kagan (CTO), and Jeff Fisher (SVP GeForce). So expect the varied presentation to cover everything from datacenters to gaming. Or, as NVIDIA puts it:
    "AI on the NVIDIA accelerated computing platform is revolutionizing everything from gaming to data centers to robotics. NVIDIA will present how AI is powering the enterprise data center and the latest products and technologies for gamers and creators."
    So be sure to join us at 11pm Eastern (03:00 UTC) to see what NVIDIA has in store for its users big and small over the coming months.


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    #11499

    Anandtech: Computex 2022: ASUS Announces ROG Swift 500 Hz G-Sync Gaming Monitor

    In direct collaboration with NVIDIA, ASUS has announced the world's first 500 Hz G-Sync enabled gaming display during Computex 2022. The latest ROG Swift 24.1-inch display will feature a 500 Hz panel with a 1080p resolution and comes loaded with features such as NVIDA's Reflex Analyzer and a new vibrance mode.
    Designed more the fast-paced eSports titles such as Counter-Strike: Global Offensive, Valorant, Overwatch, and titles like these, the latest monitor from ASUS's premium ROG Swift range now features an impressive 500 Hz E-TN display. Not to be confused with the standard TN panels, ASUS uses its new "eSport TN" technology, which ASUS claims offers 60% better response times.
    In the above video embedded, ASUS and NVIDIA give a small demonstration of the benefits of moving to 500 Hz from 240 and 144 Hz. It tests things such as animation smoothness, ghosting, and system latency.
    The ASUS ROG Swift 500Hz uses a 24.1-inch panel with a 1080p resolution. It also benefits from NVIDIA G-Sync and NVIDIA's Reflex Analyzer, which is designed to detect system latency, measure mouse clicks when using an NVIDIA Reflex certified gaming mouse, and to measure the time for the resulting pixels to change on the screen.
    ASUS also includes a new enhanced vibrance mode, which is specifically tuned for eSports and is built into the monitor's firmware. ASUS claims this allows light to travel through the LCD crystals for better color vibrancy.
    As we've seen from previous ROG Swift releases over the years, don't expect this to be cheap or affordable for the everyday gamer. At the time of writing, ASUS hasn't revealed the expected MSRP of the ROG Swift 500 Hz gaming monitor, nor does it state when it might hit retail shelves.
    Source: ASUS


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    Anandtech: Computex 2022: MSI Announces Three AM5 Motherboards For Ryzen 7000 Process

    During Computex 2022 in Taipei, Taiwan, MSI unveiled four AM5 motherboards designed for AMD's Ryzen 7000 processors, which will be landing later this year. Currently announced are the premium MEG X670E Ace, the mid-ranged MPG X670E Carbon WIFI, and the more business-focused Pro X670-P WIFI motherboards.
    Hot on the heels of AMD's announcement that its highly anticipated Ryzen 7000 processors for desktops will be dropping sometime in the fall, motherboard vendors have been slowly unveiling what boards we can expect to see at launch. MSI has dropped some limited information on four new AM5 boards, including two from its flagship MEG series, one from its gaming-focused MPG family, and one from its more affordable Pro series.
    Here is what we know so far:
    Although MSI has announced there will be an X670E Godlike, we currently don't have any images for this model. As we know from previous motherboard launches, the MSI X670E Godlike will be the company's flagship AM5 board for Ryzen 7000 processors, with a large E-ATX sized PCB and a wave of high-end enthusiast-level features. One interesting feature of the MEG series boards is a front panel USB 3.2 G2x2 Type-C header with support for 60 W power delivery.

    MSI hasn't specified much or distinguished much of its announced features between either model. Still, MSI does say the MEG series for AM5 includes a monstrous 26-phase power delivery (24+2) with 105 A smart power stages and a stacked fin array heatsink to help cool it. MSI also states that the MEG series will include a large metal backplate with up to four M.2 slots onboard and an M.2 Xpander-Z Gen5 dual add-on card supporting two PCIe 5.0 M.2 SSDs. Whether these features are specific to the entire MEG series for AM5 remains to be seen.
    The MSI MPG X670E Carbon WIFI uses a carbon black finish across the board, with two full-length PCIe 5.0 slots. MSI states the X670E Carbon WIFI will include four PCIe 5.0 M.2 slots and that the board will be powered by a 20-phase (18+2) power delivery with 90 A power stages.
    MSI's fourth and final model is the Pro X670-P WIFI motherboard, which is primarily aimed at SMEs and users looking to build a more professional type system. MSI says the X670-P WIFI will include a 16-phase (14+2) power delivery, with a single PCIe 5.0 M.2 slot and 2.5 GbE/Wi-Fi 6E networking.
    At the time of writing, MSI hasn't provided any information regarding controller sets at this time, or how much each of the four models might cost. MSI will likely give more details closer to the launch of the AMD Ryzen 7000 CPUs, which are expected to hit retail shelves in Q4 2022.
    Gallery: Computex 2022: MSI Announces Three AM5 Motherboards For Ryzen 7000 Processors


    Source: MSI



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