Thread: Anandtech News

One of the key benchmarks that have been used in the industry is Cinebench. The latest version has been Cinebench R15, released for version 15 of Cinema 4D. In recent years it has slowly become less relevant, as Maxon has moved through to version 19 and 20 of the software. To match the latest version of the software, the company has now launched the Cinebench R20 benchmark.

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While smartphone vendors have been able to cut power consumption dramatically in the past 10 years, most of those power savings has gone into making thinner phones with smaller batteries. So for heavy phone users that need a phone that can still last all day – or even longer – the best option has often been to pair a thin smartphone with a battery case in order to make up for the difference.
Every now and then, however, we still see someone release a phone with a large integrated battery, and this year at Mobile World Congress that someone was Avenir Telecom. The company, which licenses the Energizer brand for smartphone use, was showing off its prototype Energizer Power Max P18K Pop handset, a premium-tier smartphone with a whopping 18,000-mAh battery. Unabashed about its size, Avenir says that the big-batteried phone will be able to sit in standby for 50 days or play videos for two days straight, all of which is far longer than today's typical smartphones.

Equipped with a 6.2-Inch IPS display featuring a 2280x1080 resolution as well as its feature-defining 18,000-mAh battery, the Energizer Power Max P18K Pop looks an NMT-450 mobile phone from the nineties. Under the hood, the phone is based on MediaTek’s Helio P70 SoC (4x Arm Cortex-73, 4x Arm Cortex-A53, Arm Mali G72-MP3 graphics) and paired with 6 GB of RAM and 128 GB of NAND flash storage. Given the mobile platform, the device supports everything you come expect from a modern smartphone, including 4G LTE, Bluetooth 5.0, 802.11ac Wi-Fi, and so on. Meanwhile, there is a USB Type-C port to charge the massive 18,000 mAh battery.

The imaging capabilities of the Energizer Power Max P18K Pop are also on line with modern premium handsets: a triple-module camera (12 MP + 5 MP + 2 MP) can be found on the rear on the phone. Meanwhile there is a pop-up 16 MP + 2 MP camera for selfies.

The Energizer Power Max P18K Pop will be available sometime this fall, likely with a staggered regional release schedule. The recommended price of the smartphone is expected to be around €599.

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• More Qualcomm Snapdragon 845: AGM's X3 with IP68, Coming Summer 2018
• Cat at MWC 2018: S61 Smartphone with FLIR Cam, Laser Distance Measurer, Air Quality Sensor

Source: Energizer



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EKWB has introduced its EK-Annihilator Pro water block, a new, high-end water block that's designed for use with Intel's Xeon W-3175X extreme workstation processor. As the company is intending to cover a range of scanrios with their new water block, it's available for both square and narrow ILM (Independent Loading Mechanism) socket mountings, which are typically used by workstations and servers respectively.
EKWB’s EK-Annihilator Pro water blocks feature a machined copper base made of ‘purest copper available’ (according to the manufacturer) that is treated with nickel electroplating. The top of both water blocks is made of black POM acetal, whereas the hold-down brackets are made of stainless steel. Meanwhile the water blocks feature nine water ports in total in a bid to maintain compatibility with different cooling solutions. There are three standard G1/4″ ports on top for taller cooling systems, and six G1/8″ threaded ports on the sides for lower-profile coolers.

When it comes to compatibility, the EK-Annihilator Pro can work with all types of Socket P platforms and LGA3647 processors, but the they were designed primarily for Intel’s Xeon W and particularly for the Xeon W-3175X. The latter is aimed at performance-minded enthusiasts that are more likely to use custom-built liquid cooling solutions.
The EKWB EK-Annihilator Pro water blocks are already available directly from the company for €139. In the near future they will also be available from EKWB’s resellers.
Related Reading:

• Asetek Launches 690LX-PN Cooler for Xeon W-3175X: Up to 500 W
• The Intel Xeon W-3175X Review: 28 Unlocked Cores, $2999
• EKWB Reveals Velocity: A Water Block for Custom LCS with RGB Lighting
• Xeon W-3175X Roundup: Intel’s 28-Core at CES 2019

Source: EKWB

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The GIGABYTE MW51-HP0 is a CEB form-factor motherboard that is aimed at users looking to build a professional workstation on the Intel C422 chipset with support for Xeon W processors. Some of the board's key features include dual Intel NICs, ten SATA ports, support for quad-channel RDIMM and LRDIMM DDR4 memory, and seven full-length PCIe 3.0 slots backed by a single Broadcom PEX8747 PLX chip.

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In a new presentation for investors AMD announced a more precise launch plan for its client APUs and CPUs for desktop, mobile, and server computers. The company is preparing to update its whole lineup of products for different types of client and server machines later this year.
As it turns out, AMD intends to release its 2^nd Generation Ryzen Pro mobile products for notebooks this spring. AMD also plans to introduce its 3^rd Generation Ryzen processors sometimes in the middle of the year. A bit later on the company is set to launch its 3^rd Generation Ryzen Threadripper CPUs for extreme desktops and workstations. AMD’s codenamed Rome processors for servers are also due in 2019, but the manufacturer does not elaborate.

AMD’s 2^nd Gen Ryzen Pro 3000-series quad-core processors are based on the Zen+ microarchitecture and are made using GlobalFoundries’ 12LP process technology, just like their non-Pro counterparts. The latter are set to become available in the near future, so we are going to learn more about what to expect from these upcoming APUs shortly.

AMD’s 3^rd Gen Ryzen processors for desktops rely on the brand-new design code-named Matisse. The latter features two dies: a chiplet die containing eight cores based on the Zen 2 microarchitecture and built using TSMC’s 7N manufacturing process, and an I/O die built using GlobalFoundries’ 14LPP fabrication technology.
This is a breaking news. We are adding more details as we learn them.

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This morning the crew over at FanlessTech has picked up on the release of a new Intel processor list from Fujitsu. In it, Fujitsu has published what appears to be the complete list of all of Intel’s planned 9^th Gen "Coffee Lake-Refresh" Core processors. The catalogue includes some unannounced-yet-highly-anticipated 35 W TDP CPUs with up to 8 cores, new processors without integrated graphics, as well as upcoming Xeon E-2200-series products.
Intel has been rolling out its Coffee Lake-Refresh products relatively slowly so far. To date, the company has introduced nine 9^th Gen Cores CPUs for desktops that use the architecture, with these chips aimed primarily at higher-performance PCs used by enthusiasts. As it appears from Fujitsu's document, the whole series will be considerably broader and will include CPUs designed for entry-level workstations, mainstream desktops, small form-factor desktops, and entry-level PCs. According to the list, Intel is altogether prepping 32 more processors that belong to the CFL-R family. As a result, the complete Coffee Lake-Refresh series for desktops would include 41 CPUs in total.
Among notable entries in the list, Intel is readying 35 W and 65 W TDP eight-core processors. The company is also planning to release quad and six-core processors at the same TDPs. And not to be left out, there are also dual-core Celeron and Pentium Gold CPUs for mainstream and SFF desktops that are apparently inbound as well.
Interestingly, the Fujitsu's list also confirms that some of Intel’s processors for entry-level PCs will not have an integrated GPU, which is an unusual choice given that entry-level systems rarely ship with a discrete GPU.
Finally, the list also confirms that Intel is preparing its Xeon E-2200-series CPUs with four, six, and eight cores. These parts would be used to address the entry-level workstation market, offering processors that support ECC and other capabilities expected from this class of machines, And, like some of Intel's other segments, some of these new Xeons will apparently not have integrated GPUs either.
[TABLE]
[TR="class: tgrey"]
[TD="colspan: 10"]Intel 9th Gen Core CPUs (Coffee Lake-Refresh) for Desktops[/TD]
[/TR]
[TR="class: tlblue"]
[TD]Tier[/TD]
[TD]Model[/TD]
[TD]Cores[/TD]
[TD]Base
Freq[/TD]
[TD]Turbo
Freq[/TD]
[TD]L3[/TD]
[TD]IGP[/TD]
[TD]IGP
Freq[/TD]
[TD]TDP[/TD]
[TD]Status[/TD]
[/TR]
[TR]
[TD="class: tlgrey, colspan: 1"]i9[/TD]
[TD="class: tlgrey"]i9-9900K[/TD]
[TD="colspan: 1"]8 / 16[/TD]
[TD="colspan: 1"]3.6 GHz[/TD]
[TD="colspan: 1"]5.0 GHz[/TD]
[TD="colspan: 1"]16 MB[/TD]
[TD]UHD 630[/TD]
[TD]1200[/TD]
[TD="colspan: 1"]95 W[/TD]
[TD]Launched[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i9-9900KF[/TD]
[TD]-[/TD]
[TD]-[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i9-9900[/TD]
[TD="colspan: 1"]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD]UHD 630[/TD]
[TD]?[/TD]
[TD="colspan: 1"]65 W[/TD]
[TD="colspan: 1"]Pending[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i9-9900T[/TD]
[TD]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD]UHD 630[/TD]
[TD]?[/TD]
[TD]35 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey, colspan: 1"]i7[/TD]
[TD="class: tlgrey"]i7-9700K[/TD]
[TD="colspan: 1"]8 / 8[/TD]
[TD="colspan: 1"]3.6 GHz[/TD]
[TD="colspan: 1"]4.9 GHz[/TD]
[TD="colspan: 1"]12 MB[/TD]
[TD]UHD 630[/TD]
[TD]1200[/TD]
[TD="colspan: 1"]95 W[/TD]
[TD]Launched[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i7-9700KF[/TD]
[TD]-[/TD]
[TD]-[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i7-9700[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD]UHD 630[/TD]
[TD]?[/TD]
[TD="colspan: 1"]65 W[/TD]
[TD="colspan: 1"]Pending[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i7-9700F[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD]-[/TD]
[TD]-[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i7-9700T[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD]UHD 630[/TD]
[TD]?[/TD]
[TD]35 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey, colspan: 1"]i5[/TD]
[TD="class: tlgrey"]i5-9600K[/TD]
[TD="colspan: 1"]6 / 6[/TD]
[TD="colspan: 1"]3.7 GHz[/TD]
[TD="colspan: 1"]4.6 GHz[/TD]
[TD="colspan: 1"]9 MB[/TD]
[TD]UHD 630[/TD]
[TD]1150[/TD]
[TD="colspan: 1"]95 W[/TD]
[TD]Launched[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i5-9600KF[/TD]
[TD]-[/TD]
[TD]-[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i5-9600[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]UHD 630[/TD]
[TD]?[/TD]
[TD="colspan: 1"]65 W[/TD]
[TD="colspan: 1"]Pending[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i5-9600T[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]35W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i5-9500[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]65W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i5-9500F[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD]-[/TD]
[TD]-[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i5-9500T[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD]UHD 630[/TD]
[TD]?[/TD]
[TD="colspan: 1"]35 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i5-9400[/TD]
[TD]2.9 GHz[/TD]
[TD]4.1 GHz[/TD]
[TD]UHD 630[/TD]
[TD]1050[/TD]
[TD]65 W[/TD]
[TD="colspan: 1"]Launched[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i5-9400F[/TD]
[TD]2.9 GHz[/TD]
[TD]4.1 GHz[/TD]
[TD]-[/TD]
[TD]-[/TD]
[TD]65 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i5-9400T[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD]UHD 630[/TD]
[TD]?[/TD]
[TD]35 W[/TD]
[TD="colspan: 1"]Pending[/TD]
[/TR]
[TR]
[TD="class: tlgrey, colspan: 1"]i3[/TD]
[TD="class: tlgrey"]i3-9350K[/TD]
[TD="colspan: 1"]4 / 4[/TD]
[TD="colspan: 1"]4.0 GHz[/TD]
[TD="colspan: 1"]4.6 GHz[/TD]
[TD="colspan: 1"]8 MB[/TD]
[TD]UHD 630[/TD]
[TD]?[/TD]
[TD="colspan: 1"]91 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i3-9350KF[/TD]
[TD]-[/TD]
[TD]-[/TD]
[TD]Launched[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i3-9320[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD="colspan: 1"]UHD 630[/TD]
[TD]?[/TD]
[TD="colspan: 1"]62 W[/TD]
[TD="colspan: 1"]Pending[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i3-9300[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD]?[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i3-9300T[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD]?[/TD]
[TD]35 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i3-9100[/TD]
[TD]?[/TD]
[TD]4.2 GHz[/TD]
[TD="colspan: 1"]6 MB[/TD]
[TD]?[/TD]
[TD]?[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i3-9100F[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD]-[/TD]
[TD]-[/TD]
[TD]65 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]i3-9100T[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD="colspan: 1"]UHD 630[/TD]
[TD] [/TD]
[TD]35 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey, colspan: 1"]Pentium
Gold[/TD]
[TD="class: tlgrey"]G5620[/TD]
[TD="colspan: 1"]2 / 4[/TD]
[TD]4 GHz[/TD]
[TD]-[/TD]
[TD="colspan: 1"]4 MB (?)[/TD]
[TD]?[/TD]
[TD="colspan: 1"]54 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]G5600F[/TD]
[TD]?[/TD]
[TD]-[/TD]
[TD]-[/TD]
[TD]-[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]G5600T[/TD]
[TD]3.3 GHz[/TD]
[TD]-[/TD]
[TD]UHD 630[/TD]
[TD]?[/TD]
[TD]35 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]G5420[/TD]
[TD]3.8 GHz[/TD]
[TD]-[/TD]
[TD="colspan: 1"]UHD 610[/TD]
[TD]?[/TD]
[TD]58 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]G5420T[/TD]
[TD]3.2 GHz[/TD]
[TD]-[/TD]
[TD]?[/TD]
[TD]35 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey, colspan: 1"]Celeron[/TD]
[TD="class: tlgrey"]G4950[/TD]
[TD="colspan: 1"]2 / 2[/TD]
[TD]3.3 GHz[/TD]
[TD]-[/TD]
[TD="colspan: 1"]2 MB (?)[/TD]
[TD]?[/TD]
[TD="colspan: 1"]54 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]G4930[/TD]
[TD="colspan: 1"]2 / 2[/TD]
[TD]3.2 GHz[/TD]
[TD]-[/TD]
[TD]?[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]G4930T[/TD]
[TD="colspan: 1"]2 / 2[/TD]
[TD]3 GHz[/TD]
[TD]-[/TD]
[TD]?[/TD]
[TD]35 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey, colspan: 1"]Xeon
E-2200[/TD]
[TD="class: tlgrey"]E-2288G[/TD]
[TD="colspan: 1"]8 / ?[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD="colspan: 1"]UHD P630[/TD]
[TD]?[/TD]
[TD]95 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]E-2278G[/TD]
[TD="colspan: 1"]8 / ?[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD]?[/TD]
[TD]80 W[/TD]
[/TR]
[TR]
[TD="class: tlgrey"]E-22xxG[/TD]
[TD="colspan: 1"]6 / ?[/TD]
[TD]?[/TD]
[TD]?[/TD]
[TD="colspan: 1"]?[/TD]
[TD]?[/TD]
[TD]

Samsung today announced that it has started mass production of its first commercial embedded Magnetic Random Access Memory (eMRAM). Made using its 28FDS (28nm FD-SOI) process technology, the eMRAM module promises to offer higher performance and endurance when compared to eFlash. Furthermore it can be integrated into existing chips, according to the manufacturer.
Magneto resistive RAM uses a resistance-based method that determines what data is stored in a cell, which in turn is based on reading the orientation of two ferromagnetic films separated by a thin barrier. Samsung calls this process Magnetic Tunnel Junction, or MTJ.
MRAM is one of the highest-performing and most durable non-volatile memory technologies currently exists. Because its eMRAM does not require an erase cycle before writing data, it is 1,000 times faster than eFlash, Samsung says. It also uses lower voltages when compared to eFlash, and therefore consumes around 1/400th the energy during writing process, according to the maker.
On the flip side, however, MRAM’s density and capacity both fall far short of 3D XPoint, DRAM, and NAND flash, which greatly reduces its addressable markets. Samsung is not formally disclosing the capacity of its new eMRAM module; the company is only saying that it yet has to tape out a 1 Gb eMRAM chip in 2019, which strongly suggests that the current offering has a lower capacity.

Made using Samsung’s 28FDS process technology, Samsung's eMRAM module can be integrated in the back-end of a chip's manufacturing process by adding three additional masks. As a result, the module does not necessarily depend on what front-end manufacturing technology is used, allowing it to be inserted into chips produced using bulk, FinFET, or FD-SOI fabrication processes.
Given its limited capacity, Samsung says that the module is primarilly aimed for use in microcontrollers, chips for IoT, and AI (neural network, machine learning, etc.) applications.

Meanwhile, Samsung says that it will keep expanding its embedded non-volatile memory offerings going forward. Among the upcoming options is its 1 Gb eMRAM test chip, whose tape-out is scheduled for later this year. Farther down the line still, Samsung is also planning to make eMRAM using its 18FDS process, as well as more advanced FinFET-based nodes.
Related Reading:

• IBM And Everspin Announce 19TB NVMe SSD With MRAM Write Cache
• Seagate Demos New SSD Features And Prototypes At FMS
• Everspin Announces New MRAM Products And Partnerships
• MRAM Developer Day, GlobalFoundries Keynote Live Blog

Source: Samsung

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Condor Electronics introduced its new flagship smartphone at Mobile World Congress. The Allure X has a large AMOLED display with a 92% screen-to-body ratio, a higher-end SoC, and advanced imaging capabilities. The device will surprisingly not be too expensive. The manufacturer plans to sell the Allure X for around €300.



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Numerous manufacturers of smartphones either launched or demonstrated prototypes of their 5G handsets at this year's Mobile World Congress. While many of the handsets shown off supported sub-6GHz 5G capabilities, they omitted mmWave functionality since most western carriers are not going to support the feature in 2019. By contrast, Sony spent this year's event showing off a prototype of a 5G smartphone that does support mmWave. And with Japan’s NTT Docomo set to to roll-out support for the technology this year, Sony has a prime opportunity to be one of the first 5G mmWave phone vendors in their home market.
Like other mmWave-capable devices shown off at the show, Sony’s prototype 5G smartphone is based on Qualcomm’s Snapdragon X50 modem, which for technical reasons has to be paired with their 855 application processor. The handset features Sony’s signature design with sharp edges, with one of Sony’s trendy 21:9 aspect ratio OLED display underneath. Meanwhile, since the phone incorporates a number of specialized mmWave antennas, the handset is fairly sizable: it looks to be even longer than the recently introduced Xperia X1, and it's pretty thick as well.

The prototype smartphone has a dual-module camera with Zeiss optics and two LED flashes on the back. There is also a selfie camera on the front. Though it should be noted that since we are talking about a prototype, the commercial version may get different/upgraded imaging capabilities. As for physical connectivity, the handset has a USB Type-C port for data transfers as well as charging.

Sony did not say when it plans to release its Xperia 5G smartphones, but since the prototype is powered by Qualcomm’s modern platform it is safe to say that the company is inclined to launch it commercially sooner rather than later. Keeping in mind that NTT Docomo will be supporting mmWave bands this year, it is likely that Sony’s roll-out plans will depend on just how well NTT Docomo's deployment goes, at least to a certain degree.

Related Reading:

• Sizing Up The 5G Modem Market: Qualcomm, Intel, Huawei, Samsung, UniSOC, and Mediatek
• Oppo Demonstrates 5G Smartphone at MWC 2019
• OnePlus 5G Prototype: Living Large
• Qualcomm Announces X55 Modem: 5G Multi-mode & New Advanced ICs

Source: Sony

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Today we are taking a look at SeaSonic’s new SFX PSU series, the Focus Gold SGX. The new PSUs boast some impressive electrical specifications and come with a 10-year warranty, and can deliver the performance to match. For our look at the Focus Gold SGX series SeaSonic is putting their best foot forward, sending us their 650W model.

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